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High-frequency ultrasonic sensor

A high-frequency ultrasonic and sensor technology, applied in the field of sensors, can solve problems such as the adverse effects of sensor signal transmission and reception, the eccentric phenomenon of transducer assembly, and the sensor wafer falling off, so as to achieve good ultrasonic damping effect, avoid adverse effects, and improve The effect of sensitivity

Inactive Publication Date: 2010-06-23
AUDIOWELL ELECTRONICS GUANGDONG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional high-frequency ultrasonic sensor products fix the sensor chip directly on the matching layer, which may have two risks: one is that the assembly of the transducer plate may produce eccentricity, which will adversely affect the signal transmission and reception of the sensor; the other is due to the lack of Internal support, the sensor may fail due to denting of the matching layer or detachment of the sensor wafer

Method used

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Embodiment Construction

[0012] The present invention will be further described below in conjunction with accompanying drawing.

[0013] In the figure: shell 1, sensor chip 2, limit rubber ring 3, matching layer 4, PCB board 5, connecting wire 6, support limit platform 7, limit rubber ring 8, and steps 9.

[0014] as attached figure 1 , attached figure 2 As shown, the present invention is that the high-frequency ultrasonic sensor is made up of housing 1, sensor wafer 2, matching layer 4, PCB board 5 and connecting wire 6, matching layer is installed on the housing, PCB board is installed on the housing, connecting wire connects PCB Board and sensor chip, on the inside of the shell, an annular support limit platform 7 is provided, two layers of limit rubber rings are arranged on the support limit platform, and limit rubber rings 3 are arranged on the support limit platform. The rubber ring is provided with a step 9, the sensor chip is installed on the step on the limit rubber ring, the limit rubber ...

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Abstract

The invention relates to a high-frequency ultrasonic sensor, belonging to the field of sensors. The high-frequency ultrasonic sensor comprises a shell, a sensor wafer, a matching layer, a printed circuit board (PCB) and connecting leads, wherein the sensor wafer, the matching layer and the PCB are installed on the shell; the PCB is connected with the sensor wafer through the connecting leads; a supporting and spacing stand is arranged on the inner part of the shell; a spacing rubber ring is arranged on the supporting and spacing stand; and the sensor wafer is installed on the spacing rubber ring and is installed on the supporting and spacing stand. The invention effectively eliminates the possibility of cracking of the sensor wafer caused by the fact that the matching layer is pressed, effectively solves the problem of positioning of the sensor wafer, effectively eliminates the influence of the sensor shell on ultrasonic signals, has simple structure, and improves reliability and sensitivity of the sensor.

Description

technical field [0001] The high-frequency ultrasonic sensor of the invention belongs to the field of sensors. Background technique [0002] The detection accuracy of an ultrasonic sensor is closely related to its operating frequency, the higher the sensor frequency, the higher the detection accuracy. Therefore, high-frequency ultrasonic sensors are widely used in the field of industrial automation. Traditional high-frequency ultrasonic sensor products fix the sensor chip directly on the matching layer, which may have two risks: one is that the assembly of the transducer plate may produce eccentricity, which will adversely affect the signal transmission and reception of the sensor; the other is due to the lack of Internal support, the sensor may fail due to denting of the matching layer or detachment of the sensor wafer. Contents of the invention [0003] The purpose of the present invention is to avoid the deficiencies of the prior art, and provide a high-frequency ultra...

Claims

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Application Information

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IPC IPC(8): G01D5/48G01D11/24
Inventor 张曙光陈廷富黎天文
Owner AUDIOWELL ELECTRONICS GUANGDONG
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