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Device and method for measuring heat conduction coefficient, eutectic point and congruent melting point

A technology of thermal conductivity and eutectic point, which is applied in the field of measuring thermal conductivity, eutectic point and eutectic point, and can solve problems such as data accuracy and reproducibility cannot be guaranteed, equipment is not suitable for on-site measurement, and properties are unstable , to achieve the effect of reasonable and efficient drying process, compact structure and accurate test data

Inactive Publication Date: 2010-06-23
NANJING UNIVERSITY OF TRADITIONAL CHINESE MEDICINE
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, the determination of eutectic point and eutectic point is often determined by resistance method, but there is no fixed equipment, and the accuracy and reproducibility of the measured data cannot be guaranteed.
Differential scanning method is commonly used in the determination of thermal conductivity, but this type of equipment is not suitable for on-site determination
Moreover, it is not suitable for some analytes that are unstable in nature and easy to deform under normal pressure and temperature.

Method used

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  • Device and method for measuring heat conduction coefficient, eutectic point and congruent melting point
  • Device and method for measuring heat conduction coefficient, eutectic point and congruent melting point

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Embodiment 1

[0042] A device for measuring thermal conductivity, eutectic point and eutectic point, comprising a heat preservation container 1 for measuring eutectic point and a heat preservation container 2 for measuring eutectic point, and two heat preservation containers 1 and 2 are installed in a heat preservation space 3; Two heat-retaining containers 1 and 2 are respectively provided with two probes 4 and thermistor 5 for measuring resistance, and the probe 4 and thermistor 5 for measuring resistance are connected with PLC processing systems 6 and 7; The insulation container 1 at the point is a three-layer structure, the inner layer is equipped with the article to be tested, the middle layer is a cold medium, and the outer layer is a hollow wall interlayer; the insulation container 2 for measuring the eutectic point is a three-layer structure, and the inner layer is equipped with the object to be tested , the middle layer is a heat medium, and the outer layer is a hollow wall interlay...

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Abstract

The invention relates to a device for measuring a heat conduction coefficient, a eutectic point and a congruent melting point, which is characterized by comprising a heat preservation container for measuring the eutectic point and a heat preservation container for measuring the congruent melting point. The two heat preservation containers are arranged in a heat preservation space and respectively provided with probes for measuring the resistance and thermal resistors; the probes for measuring the resistance and the thermal resistors are connected with a PLC (Programmable Logic Controller) processing system; a low-temperature program temperature control system is connected with an interlayer in a hollow wall of the heat preservation container for measuring the eutectic point; a heating program temperature control system is connected with an interlayer in a hollow wall of the heat preservation container for measuring the congruent melting point; and a vacuum control system is connected with the heat preservation container for measuring the congruent melting point. The invention also relates to a method for measuring the heat conduction coefficient, the eutectic point and the congruent melting point by the device. The device has compact structure, can measure the heat conduction coefficient, the eutectic point and the congruent melting point at the same time, and can be used for field measurement with accurate test data.

Description

technical field [0001] The invention relates to a device for directly measuring the thermal conductivity, eutectic point and eutectic point of substances (especially solutions) on site, and further includes a testing method based on the device. Background technique [0002] Thermal conductivity is also called thermal conductivity. Thermal conductivity / thermal conductivity means that under stable heat transfer conditions, a material with a thickness of 1m and a temperature difference of 1 degree Celsius (K, ℃) on both sides of the surface pass through an area of ​​1 square meter within 1 hour. The heat transfer, the unit is watts / meter × degree Celsius. The thermal conductivity was obtained by the thermistor method. The thermal conductivity can determine some basic thermophysical properties of the solution, and can indirectly reflect the freeze-drying effect. [0003] The solution does not condense at a fixed temperature, but condenses within a certain temperature range. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/04G01N25/20
Inventor 张兴德程建明蔡宝昌刘亮嵇晶周洪亮吕游春
Owner NANJING UNIVERSITY OF TRADITIONAL CHINESE MEDICINE
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