Semiconductor packaging piece with heat dissipation structure
A technology of heat dissipation structure and semiconductor, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problem of difficult control of the flatness of the heat sink
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0058] Such as Figure 1A Shown is a cross-sectional view of the semiconductor package according to the first embodiment of the present invention. The semiconductor package 1 of the first embodiment is composed of a substrate 10, a semiconductor chip 11 bonded on the substrate 10, a heat dissipation structure 12 bonded on the semiconductor chip 11, and a heat dissipation structure 12 formed on the substrate 10 to package The encapsulation compound 13 covering the semiconductor chip 11 and part of the heat dissipation structure 12 is formed.
[0059] The substrate 10 is a known flip-chip substrate in this embodiment, so that the semiconductor chip 11 is electrically connected to the upper surface of the substrate 10 through a plurality of solder bumps (Solder Bumps) 14 in a flip-chip manner. 100; at the same time, on the lower surface 101 relative to the upper surface 100, a plurality of solder balls (SolderBalls) 15 arranged in an array (Array) are planted, so that the semico...
no. 2 example
[0065] Such as Figure 2A Shown is a cross-sectional view of the semiconductor package according to the second embodiment of the present invention. As shown in the figure, the structure of the semiconductor package 2 of the second embodiment is substantially the same as that provided in the first embodiment, the difference is that the first heat sink 221 is a corrugated sheet structure. Depend on Figure 2B From the perspective view of the first heat dissipation element 221, it can be seen that the first heat dissipation element 221 is formed with a plurality of openings 221d, so as to jointly form a channel for the adhesive 220 to pass through and be filled with the groove 221e formed between any two adjacent waves. . The wavy first heat sink 221 is the same as the first heat sink 121 provided in the aforementioned first embodiment, and both have a wave-shaped structure that can be elastically deformed and extended, so that the first heat sink 221 can have a It is elastica...
no. 3 example
[0067] Such as Figure 3A Shown is a cross-sectional view of a semiconductor package according to a third embodiment of the present invention. As shown in the figure, the structure of the semiconductor package 3 of the third embodiment is substantially the same as that provided by the first embodiment, the difference is that the first heat sink 321 is formed of a flat metal sheet. Such as Figure 3BFrom the perspective view of the first heat sink 321, it can be seen that the first heat sink 321 is formed with a plurality of channels 321c for the adhesive 320 to pass through and be filled therein. Any geometric shapes such as ellipses, polygons are also suitable.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 
PatSnap Eureka turns technology decisions into work you can execute. Powered by our Innovation Knowledge Graph, it runs expert workflows across engineering, life sciences, materials and intellectual property. Get your review-ready output in minutes.
