Fixing structure of radiator

Abstract

The present invention relates to a fixing structure of a radiator, which is arranged on a circuit board, wherein at least one electronic element is arranged on the circuit board, and the circuit board is provided with a through hole. The fixing structure of a radiator at least comprises the radiator and at least one fixing structure. The radiator is provided with at least one guide rail structure. The fixing structure is provided with a first member and a second member. The first member is correspondingly arranged in the guide rail structure of the radiator. The second member passes through to be arranged to the through hole of the circuit board, and is pushed against the bottom of the circuit board to enable the radiator to be fixedly arranged on the circuit board to radiate the electronic element. The fixing structure of a radiator can effectively increase the radiating efficiency, simplify the assembling processes and time, and also largely save the labor cost.

Description

technical field [0001] The invention relates to a radiator fixing structure, in particular to a radiator fixing structure which utilizes the fixing structure to assist in fixing the radiator on a circuit board. Background technique [0002] With the rapid development of the computer industry and the trend of diversification and miniaturization of electronic devices, the accumulation of electronic components on the circuit board is increasing, making the insulation and heat dissipation of electronic components more important, especially in many control equipment, Power transistors that must be used in measuring instruments, electrical equipment, computer peripherals, etc., because their main function is signal processing or power drive, and usually deal with relatively high-power signals, so the heat emitted is relatively large, and more needs Deal with cooling issues. [0003] In order to solve the problem of heat dissipation inside the electronic device, various heat sinks...

AI Technical Summary

Problems solved by technology

[0010] Another object of the present invention is to provide a heat sink fixing structure and its assembly method, so as to solve the complicated manufacturing process of the existing heat sink mounted on the circuit board, resulting in a waste of time, cost and human resources.

[0011] Another object of the present invention is to provide a heat sink fixing structure to solve the problem that the fixed terminal needs to be set at a specific position when the existing heat sink is installed on the circuit board, which causes inconvenience in use.

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