Process for manufacturing multi-layered thin film by dry vacuum vapor deposition
A vapor deposition, multi-layer thin-film technology, applied in superimposed layer plating, vacuum evaporation plating, semiconductor/solid-state device manufacturing, etc., can solve problems such as the inability to achieve the unique characteristics of the matrix, increased production time, and high production costs. Achieve beautiful and luxurious visual design, eliminate or reduce environmental pollution, and ensure the effect of reliability
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[0041] Compared with a conventional coating provided by a wet method, the vacuum vapor deposition method for producing a thin film of the present invention is characterized in that the coating is formed by a dry method in a vacuum vapor deposition apparatus. Conventional coatings currently provided by wet methods may include, for example, UV (ultraviolet) hardening type coatings, base coats for improving the adhesion strength between Layer coat of top coat.
[0042] In the vacuum vapor deposition method (dry method) of the present invention, the chemical reagents for forming each thin film layer are used to provide a stable single-layer or multi-layer coating in a vacuum vapor deposition device by an ultra-thin coating method, preferably using Vector as described in Korean Patent Application No. 10-2007-0075000.
[0043] Suitable substrates to which the film manufacturing method of the present invention can be applied include, but are not limited to, casings, windows, window-...
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