Chip surface contact glass packaging rectifier tube and manufacturing method thereof

Abstract

The invention discloses a chip surface contact glass packaging rectifier tube, which comprises two dumet wire electrodes, a glass shell and a glass-coated chip. One end of each dumet wire electrode, which is inserted in the glass shell, is connected with a dumet wire block. The glass-coated chip is embedded between the dumet wire blocks of the two dumet wire electrodes. A filling material for increasing the electric connection between the glass-coated chip and the dumet wire blocks is respectively filled between the glass-coated chip and the dumet wire blocks on both sides of the glass-coatedchip. The other sides of the glass-coated chip are completely coated by glass cement. The invention also discloses a manufacturing method for the chip surface contact glass packaging rectifier tube. The chip surface contact glass packaging rectifier tube has low raw material cost and better current impact resistance and allows more larger operating current. The manufacturing method of the invention is suitable for the industrial batch production, the investments of the industrial production equipment and the labor power are much less than that of the epoxy molding compound packaging and the yield is much more than the epoxy molding compound packaging.

Description

technical field [0001] The invention relates to a chip-type surface-contact glass-encapsulated rectifier tube and a manufacturing method thereof. Background technique [0002] At present, most of the glass-encapsulated diode chips and electrodes are of point contact type. Point contact type diodes have low operating current, low withstand voltage, and poor heat dissipation, so they are often only used in applications below 1W. The rectifier tube is a kind of diode. Due to the large working current, the surface contact method is generally used between the chip and the electrode, and the packaging method is mostly epoxy plastic packaging. High characteristics, but epoxy plastic packaging is more expensive than glass packaging. Contents of the invention [0003] The technical problem to be solved by the present invention is to adopt low-cost glass encapsulation to realize a patch-type surface-contact glass-encapsulated rectifier with better current shock resistance and highe...

AI Technical Summary

Problems solved by technology

[0002] At present, most of the glass-encapsulated diode chips and electrodes are of point contact type. Point contact type diodes have low operating current, low withstand voltage, and poor heat dissipation, so they are often only used in applications below 1W.

The rectifier tube is a kind of diode. Due to the large working current, the surface contact method is generally used between the chip and the electrode, and the packaging method is mostly epoxy plastic packaging. High characteristics, but epoxy plastic package is more costly than glass package

Images