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Unit for supporting a substrate and apparatus for processing a substrate having the same

A support unit and base plate technology, applied in support structure installation, electrical components, cooling/ventilation/heating transformation, etc., can solve the problems of thermal deformation of the base 20 and support part 30, metal impurity contamination of the base plate S, vacuum leakage, etc.

Inactive Publication Date: 2010-08-04
MICOCERAMICS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In summary, when using the substrate support to process the substrate, the substrate S will be heated unevenly due to heat loss through the support 30; the substrate S will be contaminated by metal impurities; 20 and the support portion 30 may be thermally deformed; or due to degradation of the sealing member 50, a vacuum leak may occur between the support portion 30 and the chamber 60

Method used

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  • Unit for supporting a substrate and apparatus for processing a substrate having the same
  • Unit for supporting a substrate and apparatus for processing a substrate having the same
  • Unit for supporting a substrate and apparatus for processing a substrate having the same

Examples

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Embodiment Construction

[0037] Various embodiments will be described in more detail below with reference to the accompanying drawings that illustrate the embodiments. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In these drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

[0038] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or directly connected to the other element or layer. Layers, or the presence of intervening elements or layers. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers p...

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Abstract

A substrate support unit of a substrate processing apparatus includes a first support member, a second support member, a buffer member and a tube. The first support member has an electrode and a heater built-in and supports the substrate. The second support member is disposed beneath the first support member to support the first support member. The buffer member is disposed between the first support member and the second support member to form an air gap between the first support member and the second support member so as to reduce heat transfer between the first support member and the second support member. The tube is connected with a lower surface of the first support member. Further, the tube extends through the second support member and receives lines for applying power to the electrode and the heater.

Description

technical field [0001] Embodiments generally relate to a substrate supporting unit, and a substrate processing apparatus having the substrate supporting unit. In particular, embodiments relate to a unit that supports and heats a substrate for processing the substrate, and a substrate processing apparatus having the same. Background technique [0002] In semiconductor or flat panel display processing processes, various processes are generally performed to manufacture semiconductor devices or flat panel displays while substrates such as silicon wafers and glass substrates are supported by the substrates in a vacuum chamber. Examples of the substrate supporting unit may include a clamp using mechanical force, a vacuum chuck using vacuum force, an elastic chuck using elastic force, and the like. [0003] The structure of the jig is complex and easily soiled or deformed during handling. In addition, the vacuum chuck, on which the surface portion of the substrate is held, is eas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH01L21/67109H01L21/67103H01L21/6831H05K7/20H05K7/14
Inventor 曹尚范郑炳晋朴明河朴重现
Owner MICOCERAMICS LTD
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