Unit for supporting a substrate and apparatus for processing a substrate having the same

A support unit and base plate technology, applied in support structure installation, electrical components, cooling/ventilation/heating transformation, etc., can solve the problems of thermal deformation of the base 20 and support part 30, metal impurity contamination of the base plate S, vacuum leakage, etc.
CN101796898AInactive Publication Date: 2010-08-04MICOCERAMICS LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
MICOCERAMICS LTD
Publication Date
2010-08-04
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

A substrate support unit of a substrate processing apparatus includes a first support member, a second support member, a buffer member and a tube. The first support member has an electrode and a heater built-in and supports the substrate. The second support member is disposed beneath the first support member to support the first support member. The buffer member is disposed between the first support member and the second support member to form an air gap between the first support member and the second support member so as to reduce heat transfer between the first support member and the second support member. The tube is connected with a lower surface of the first support member. Further, the tube extends through the second support member and receives lines for applying power to the electrode and the heater.
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Description

technical field

[0001] Embodiments generally relate to a substrate supporting unit, and a substrate processing apparatus having the substrate supporting unit. In particular, embodiments relate to a unit that supports and heats a substrate for processing the substrate, and a substrate processing apparatus having the same. Background technique

[0002] In semiconductor or flat panel display processing processes, various processes are generally performed to manufacture semiconductor devices or flat panel displays while substrates such as silicon wafers and glass substrates are supported by the substrates in a vacuum chamber. Examples of the substrate supporting unit may include a clamp using mechanical force, a vacuum chuck using vacuum force, an elastic chuck using elastic force, and the like.

[0003] The structure of the jig is complex and easily soiled or deformed during handling. In addition, the vacuum chuck, on which the surface portion of the substrate is held, is eas...

Claims

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