Welding method of target assembly

Abstract

The invention relates to a welding method of a target assembly. A pressure device having the functions of adsorption and pressurization is used by the method, and the pressure device comprises one or more working ends. The method comprises the following steps of: preheating a back plate and distributing solders on a bonding surface of the back plate; ensuring that the pressure device works under an adsorption state and adsorbing a target onto the back plate by using the working ends of the pressure device to ensure that a bonding surface of the target and the bonding surface of the back plate are jointed; ensuring that the pressure device works under a pressurization state, pressurizing the target by using the working ends of the pressurization device and welding while pressurizing; and cooling the target assembly. The invention can shorten the manufacture time, improve the manufacture efficiency, reduce the oxidation degree of the target and avoid the condition that the jointed target and the back plate have malpositions so as to obtain the target assembly with better quality. Moreover, the invention has small equipment using amount and smaller required space.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a target component welding method. Background technique [0002] Sputtering coating technology is used in many fields, and it can provide a film layer with an atomically smooth surface that can precisely control the thickness. In the sputtering coating process, a back plate is usually used to fix the sputtering target, that is, the target (including the target blank that has not been processed into a finished product) is connected to the back plate for fixing by means such as welding. Here, the target used for sputtering and the back plate used to fix the target connected together are called “target assembly”, the back plate assembles the target to the sputtering base, and at the same time The back plate also has the function of conducting heat. [0003] At present, target components are especially large-size targets (generally, circular targets with a diameter greate...

AI Technical Summary

Problems solved by technology

However, this welding method needs to disassemble and assemble the fixture, which has many steps and complicated operations, which is not conducive to the realization of mechanization and automation of production, prolongs the welding time, and reduces production efficiency

In addition, this welding method must be machined, and the production cost is high; moreover, the surface to be welded of the back plate needs to be processed to form an angle of 0.5° to 5° with the horizontal plane, which requires high processing requirements and is not conducive to implementation.

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