Light emitting diode base plate heat radiation structure and manufacture method thereof

Abstract

The invention relates to a light emitting diode circuit board heat radiation structure, which comprises a circuit board and a light emitting diode, wherein the light emitting diode is communicated with a circuit of a conductive circuit layer in the circuit board, a heat radiation bottom plate is tightly pasted on the lower surface of the circuit board, a through hole is formed in the position of the circuit board provided with the light emitting diode, and the light emitting diode is pasted on the inner surface of the bottom plate through the through hole. Through the additional arrangement of the heat conductive plate, the structure eliminates the adverse influence caused by self damage of the circuit board and the subsequent manufacture and processing in the prior art, and the light emitting diode can be directly pasted on the heat radiation bottom plate, so the whole base plate has higher heat conduction coefficient, the light ray emitting effect and the heat radiation effect are good, in addition, the manufacture and processing process of the existing circuit board can not be influenced, the bottom plate can be singly processed, the smoothness and the finish degree of the bottom plate can be easily ensured, the processing step is greatly simplified, and the manufacture difficulty is reduced, so the production cost is reduced.

Description

technical field [0001] The invention relates to an improvement of a heat dissipation structure of a substrate. Background technique [0002] In the past, light-emitting diodes were developed to be installed on aluminum substrates as lighting sources. Especially in recent years, as the thermal conductivity of aluminum substrates has gradually increased, the driving current of light-emitting diodes can use a larger current. Furthermore, in order to reduce the volume of the lighting source, the integration degree of the light emitting diodes mounted on the aluminum substrate is originally higher. However, under the higher driving current of the highly integrated lighting source, the light-emitting diode will relatively generate more heat, which will affect other performances due to overheating, and even cause damage to the light-emitting diode. Please refer to Figure 1. [0003] In order to further increase the thermal conductivity of the aluminum substrate and reduce its the...

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Problems solved by technology

[0004] In order to solve the problem of poor reflection effect and unevenness of the aluminum plate at the bottom above, a scheme of silver-plating the conductive circuit layer contained on the aluminum substrate and the aluminum plate is proposed, but because the conductive circuit layer is silver-plated, the light-emitting diodes drawn out The soldering of gold wires on the silver-plated conductive circuit layer has the problem of weak soldering

[0005] In order to solve the above problem of weak welding, it is proposed to plate silver on the aluminum plate to improve the reflection effect, and to plate the conductive circuit layer with gold to solve the problem of weak welding. However, due to the difficulty of this process technology, the aluminum substrate with this structure has not been widely used. use

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