Quartz crystal resonator and manufacture process thereof

A technology of quartz crystal and processing technology, applied in the field of quartz crystal resonator structure, can solve the problems of large stress change, complex structure, inability to achieve miniaturization, etc., and achieve the effect of low cost and small volume

Active Publication Date: 2010-08-25
MDH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the types of quartz crystal resonators mainly include lead-type bases and surface-mount bases. Lead-type bases are shown in Figure 1, also known as 49s/SMD quartz crystal resonators. Its process is stable and the price is low. , are basically produced domestically, but it cannot be miniaturized because:
[0004] 1. The size of the quartz wafer is 8mm*2mm;
[0005] 2. The welding method is resistance welding. When the height of the substrate is less than 0.7mm, the stress changes greatly after sealing, and the deformation of the substrate leads to a large frequency dispersion of the quartz crystal resonator, which

Method used

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  • Quartz crystal resonator and manufacture process thereof
  • Quartz crystal resonator and manufacture process thereof
  • Quartz crystal resonator and manufacture process thereof

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Experimental program
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Effect test

Embodiment 1

[0046] Referring to Figure 7, the quartz crystal resonator includes a substrate 2 covering the shell 1 on the upper part. The substrate 2 is sintered with the insulator 5 and the lead 6 to form a base. The nail head of the lead 6 is connected by spot welding to the shell 1 for support The reed 4 of the quartz wafer, the distance between the outer ends A and B of the two reeds 4 is 4.5mm, the center distance of the two insulators 5 is 2.5mm, the height of the substrate 2 is 0.7mm, and the quartz wafer is 4*1.8mm, The pressure sealing method between the housing 1 and the base is a resistance welding method; the angle a between the reed 4 and the substrate 2 is 6-8°.

[0047] The lead type quartz crystal resonator has a length of 7mm, a width of 4mm, and a height of 1.8mm.

[0048] Infrastructure analysis and comparison

[0049] The size and structure of 49s / SMD, SMD and 7040 quartz crystal resonators are as follows:

[0050]

long

width

high

Substrate material

Package form

Chip...

Embodiment 2

[0065] The difference from Embodiment 1 is that the distance between the outer ends A and B of the two reeds 4 is 4mm, the center distance between the two insulators 5 is 2mm, the height of the substrate 2 is 0.4mm, and the quartz wafer is 3.5*1.8mm. The sealing method is the resistance welding method; the angle a between the reed 4 and the substrate 2 is 6~8°.

[0066] The lead type quartz crystal resonator has a length of 6mm, a width of 3mm, and a height of 1.5mm.

[0067] 1) Quartz wafer selection: 3.5*1.8mm quartz wafer, frequency range from 10MHz-50MHz; overtone frequency range from 30MHz-125MHz;

[0068] 2) Shell: The length*width*height of the shell size is 6.5mm*1.0mm*0.15mm;

[0069] 3) Substrate: The length*width*height of the substrate size is 6.5mm*3.75mm*0.5mm;

[0070] 4) Insulator: The diameter * height of the insulator size is φ1.1mm*0.5mm.

Embodiment 3

[0072] Referring to Fig. 8, the difference from embodiment 1 is that after the processing process is sealed by resistance welding, an insulating gasket 3 is also covered under the substrate 2. The gasket 3 is provided with an opening 7 and a groove through which the lead 6 passes. Slot 8, bend the lead 6 and embed it in the gasket to make a surface mount quartz crystal resonator with a height of 2.5mm.

[0073] Effect: The lead type volume of the 7040 type resistance welding quartz crystal resonator in the above embodiment is 6.5mm*3.75mm*1.5mm; the surface mount type volume is 7mm*4mm*2mm; the product volume is the existing lead type quartz crystal resonator The material cost is 50% of the surface-mount quartz crystal resonator. The material is completely domestic and can be mass-produced, achieving the goal of miniaturization and low production cost.

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Abstract

The invention relates to a quartz crystal resonator and a manufacture process thereof, belonging to the technical field of quartz crystal resonator structures. The quartz crystal resonator comprises a substrate (2), wherein a shell (1) is coated on the upper part of the substrate (2); the substrate (2), insulators (5) and a lead wire (6) are sintered to form a base; and the nail head of the lead wire (6) is arranged in the shell (1) by spot welding for supporting reeds (4) of a quartz wafer. The resonator is characterized in that the distance between outer ends of the two reeds (4) is 4.5mm or less, and the distance between centers of the two insulators (5) is 2.5mm or less; the height of the substrate (2) is 0.7mm or less, and the height of the quartz wafer is 4*1.8mm or less; and the press sealing mode is electric resistance welding encapsulation. The resonator realizes miniaturization of the quartz crystal resonator, combines the crystal technology of the surface mounted quartz crystal resonator and the press sealing technology of the lead carrying type quartz crystal resonator to produce small-size surface mount products of the quartz crystal resonator, and is a small-size surface mounting type quartz crystal resonator in the electric resistance welding mode.

Description

Technical field [0001] The invention relates to a quartz crystal resonator and a processing technique, belonging to the technical field of quartz crystal resonator structures. Background technique [0002] The working principle of the quartz crystal resonator is a resonant device made of the inverse piezoelectric effect of quartz crystal (silicon dioxide, single crystal structure α quartz). At present, quartz crystal resonators have become an important component of the digital information society in the future. Its main market areas are the communication field, industrial use, and consumer electronic equipment fields; quartz crystal components have the characteristics of high precision and high stability, and are widely used in the need for stability. Among all kinds of equipment, instruments, and electronic products for frequency and frequency selection, it is an indispensable key component in today's electronic products. As the development trend of electronic products is multi...

Claims

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Application Information

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IPC IPC(8): H03H9/19H03H9/05H03H3/04
Inventor 李斌黄屹
Owner MDH TECH CO LTD
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