System for realizing thermal simulation and control of ATCA subframe

Abstract

The invention discloses a system for realizing the thermal simulation and control of an advanced telecom computing architecture (ATCA) subframe, which relates to the technical field of communication devices. The system comprises a micro-computer unit (MCU) singlechip, a DC / DC power module and a backboard 3V5 / 5V power supply, wherein the DC / DC power module supplies power to the MCU singlechip; and the MCU singlechip is directly connected with a 232 chip communicating with a personal computer (PC), an I2C communication chip communicating with a management disk, a temperature sensor, a heating module and a panel having a hot-plug switch. In the system for realizing the thermal simulation and control of the ATCA subframe, a thermal simulation test and the verification and evaluation of the actual radiating capacity of the system can be performed before the single disk development of the system so as to greatly reduce the risk of the design and development of a radiation part (for example, a fan single disk and the like) of the system, and simultaneously guide research and development engineers to select the type and shape of the radiation part and guide structural engineers to design the whole structure.

Description

technical field [0001] The invention relates to the technical field of communication equipment, in particular to a system for realizing thermal simulation and control of ATCA subframes. Background technique [0002] For issues such as cabinet heat dissipation, there is currently no clear and unified standard in the industry. It is this status quo that has led to the latest industry standard for communication cabinets: PICMG 3.0R2.0 AdvancedTCA (hereinafter referred to as ATCA), which requires 200W per slot. cooling capacity. Although ATCA is a standard accepted by the industry, and established the industry-recognized ATCA testing standard association CP-TA, ATCA only stipulates specific parameter requirements such as heat dissipation, but does not specify how to implement and test. Therefore, how to test and verify the actual cooling capacity of the communication cabinet has gradually become a difficult point in the development of sub-frames, sub-racks or chassis systems. ...

AI Technical Summary

Problems solved by technology

In the past, the heat dissipation design of the cabinet could only be designed based on experience. After the single-disk chassis was completed, it was judged whether the heat dissipation capability was qualified by simply testing the temperature difference between the inlet and outlet. design, and there is no specific and feasible improvement plan

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