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Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity

A high thermal conductivity, circuit board technology, applied in the electrical field, can solve the problems of no further conduction of heat sink heat, damage to the circuit board electrical circuit, limited heat dissipation effect, etc., to achieve simple structure, avoid reprocessing, and low cost.

Inactive Publication Date: 2010-09-22
ZHUHAI BONTECH ELECTRIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned patented technology is only aimed at the installation of the heat sink on the circuit board after the electrical circuit has been completed, and its defects are: first, the process of installing the heat sink is an independent process after the circuit board is completed, which increases the workload; secondly, through When the die squeezes the heat sink, it may damage the electrical circuit on the circuit board
It can be said that the above-mentioned patented technology is more suitable for the installation of individual power devices, but not suitable for the installation of a large number of power devices with high density and array distribution.
In addition, the heat of the heat sink in the above-mentioned patented technology has no further conduction, and the heat dissipation effect is limited

Method used

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  • Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity
  • Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity
  • Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity

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Embodiment 1

[0022] See Figure 1A-Figure 1F The method for making a circuit board with high thermal conductivity by the mimeograph method provided in this embodiment includes the following steps:

[0023] (1) Open some through holes 11 on the insulating substrate layer 1 (which can be FR4 sheet or BT sheet); (2) Make some metal heat conduction columns 4 that cooperate with the through holes; (3) Make the metal heat conduction columns 4 Put it into the through hole 11, and hot press and solidify; (4) The upper surface of the insulating substrate layer 1 mimeographs the conductive layer 2, and the lower surface mimeographs the heat-conducting layer 3, and the conductive layer 2 and the heat-conducting layer 3 are made of silver oil, copper oil or carbon (5) etching excess conductive material on the upper surface of the insulating substrate layer 1 to form electrical connection lines and a number of pads 22 ( Figure 1E Only pads are shown in ); the method provided by this embodiment may fur...

Embodiment 1

[0025] The high thermal conductivity circuit board that embodiment 1 makes is as Figure 1F As shown, it includes: an insulating substrate layer 1, a mimeograph conductive layer 2 located on the upper surface of the insulating substrate layer, a mimeograph thermally conductive layer 3 located on the lower surface of the insulating substrate layer, and a metal thermally conductive column 4; A through hole 11 is opened at the place where the heating element is set; the metal heat conduction column 4 is arranged in the through hole 11, and its upper end is used for thermal conduction cooperation with a preset heating element (not shown in the figure), and the lower end is for thermal conduction cooperation with the mimeograph heat conduction layer 3 . It includes an insulating base material layer 1, an electrical circuit layer on the upper surface of the insulating base material layer, a mimeograph heat-conducting layer 3 on the lower surface of the insulating base material layer,...

Embodiment 2

[0027] See Figure 2A-Figure 2F , the method for making a high thermal conductivity circuit board provided by this embodiment includes the following steps:

[0028] (1) Provide an insulating substrate layer 1 (which can be FR4 sheet or BT sheet), and attach a metal heat conducting layer 3 on the lower surface of the insulating substrate layer 1 to form a sheet with a metal layer on one side; (2) A number of through holes 11 are opened on the sheet with a metal layer; (3) a number of metal heat conduction columns 4 matching with the through holes are manufactured; (4) metal heat conduction columns 4 are placed in the through holes 11, hot-pressed and solidified; (5) Conductive layer 2 is mimeographed on the upper surface of insulating base material layer 1, and conductive layer 2 is materials such as silver oil, copper oil or carbon oil; Disc 22 ( Figure 2E Only pads are shown in ); the method provided by this embodiment may further include step (7): selectively plating elec...

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Abstract

The invention relates to a method for manufacturing a circuit board with high thermal conductivity by an oil printing method and the circuit board with high thermal conductivity and aims to solve the radiating problem of a heating element on the circuit board. The assembling process of a heat-conducting post is integrated into the manufacturing process of the circuit board per se comprehensively according to the realizing process of the circuit board with high thermal conductivity and overall arrangement. The method is mainly characterized in that: before an electrically-connected circuit is formed, the heat-conducting post is assembled on a predetermined position in the circuit board, a conducting layer is printed by stencil and an electric circuit is etched, so retreatment after the circuit board is molded is avoided. An arranged metal layer can further dissipate heat on the heat-conducting post. The circuit board has the advantages of better radiating effect, simple and convenient operation, simple structure and low cost.

Description

【Technical field】 [0001] The invention relates to a printed circuit board in the electrical field and a manufacturing method thereof. 【Background technique】 [0002] The power device heats up significantly during the working process. If the heat cannot be dissipated in time, the power device may be damaged, and even the entire electronic product may work abnormally. Taking LED lighting products as an example, a large number of LEDs are usually arranged intensively on the circuit board. When the LEDs work for a long time, the heat accumulation will shorten the life of the LEDs and make the product characteristics unstable. [0003] China Patent Application No. 200810241905.2 discloses a method for assembling a heat sink on a circuit board and a heat dissipation circuit substrate manufactured by the method. The method for assembling the heat sink comprises the following steps: making at least one through hole on the circuit board; making a heat sink matching the clearance of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/02
Inventor 孙百荣
Owner ZHUHAI BONTECH ELECTRIC TECH
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