Manufacturing method of thermal column

A technology of heat column and heat transfer element is applied in the field of structure and manufacture of heat transfer element of high-power LED light source to achieve the effect of small thermal resistance and ensure normal operation.

Active Publication Date: 2010-09-29
嘉善恒杰热管科技有限公司
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AI Technical Summary

Problems solved by technology

[0003] The invention provides a method for making a heat column. The structure makes the part of the main body of the heat transfer element part that needs to be brazed between the bottom plate and the pipe body set up a cross-section that is rectangular, triangular, arc-shaped, and combinations thereof. Solder isola

Method used

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  • Manufacturing method of thermal column
  • Manufacturing method of thermal column
  • Manufacturing method of thermal column

Examples

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[0052] The method of assembling and welding hot column sintering is decomposed into itemized sintering and then assembled and then brazed. The hot column tube body is inserted into the mandrel, and the electrolytic copper powder is vibrated into the interlayer through a special funnel for sintering, and the evaporation section of the bottom plate is used The fixture is positioned and sintered to produce a sintered copper powder layer that meets the required shape. The hot column tube body 2 is assembled with the bottom plate 1, so that the sintered layer on the bottom plate is embedded in the copper powder sintered layer of the tube body. The effect is that the sintered layer of each part of the hot column forms a complete The connecting body is very conducive to the smooth circulation of the working fluid; install a silver alloy wire ring between the hot column tube body and the bottom plate, and insert the liquid injection and vacuum tube and the wire ring into the furnace for ...

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Abstract

The invention provides a structure of a heat transfer element, i.e. thermal column and a manufacturing method thereof. Stamping or extrusion is utilized to prepare pure copper metal barrel and a base plate; the inner cavity of the thermal column is provided with various capillary structures, such as sintered copper powder, copper nets, grooves and the like; after being sintered, the capillary structures are assembled to cause capillary tissues in the cavity to be fully communicated, and the thermal column is obtained by welding, injection and vacuum degassing. The invention can effectively solve the problem of working medium backflow and blockade in the processes of liquid heat transfer medium evaporation and condensation phase change so as to greatly improve heat transfer performance; asthe heat radiation core element, the thermal column can satisfy the operating requirements on high heat dissipation power and light weight of computer microprocessors, large-power LED illumination and integrated circuit radiators.

Description

technical field [0001] The invention relates to a core component of a heat dissipation device, in particular to a structure and a manufacturing method of a high-power LED light source heat transfer component used for heating electronic components. Background technique [0002] Most electronic products such as computers, communications, and photoelectric lighting will generate heat when they work. Solving the problem of heat dissipation plays a vital role in the normal operation and life of electronic products. Radiators made of heat columns as core heat transfer components have shown It is a heat dissipation component suitable for the development of new generation electronic products; it has achieved very good results in solving the heat dissipation of integrated single high-power LED lighting sources; in recent years, thermal column products have developed rapidly, but the structure is relatively single, very good There are many deficiencies in the solution to the complete ...

Claims

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Application Information

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IPC IPC(8): F28D15/04B23P15/26B22F7/04B22F5/00
CPCF28D15/046F28D15/0283
Inventor 杨互助苏维波杨子杰
Owner 嘉善恒杰热管科技有限公司
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