Manufacturing method of thermal column

Abstract

The invention provides a structure of a heat transfer element, i.e. thermal column and a manufacturing method thereof. Stamping or extrusion is utilized to prepare pure copper metal barrel and a base plate; the inner cavity of the thermal column is provided with various capillary structures, such as sintered copper powder, copper nets, grooves and the like; after being sintered, the capillary structures are assembled to cause capillary tissues in the cavity to be fully communicated, and the thermal column is obtained by welding, injection and vacuum degassing. The invention can effectively solve the problem of working medium backflow and blockade in the processes of liquid heat transfer medium evaporation and condensation phase change so as to greatly improve heat transfer performance; asthe heat radiation core element, the thermal column can satisfy the operating requirements on high heat dissipation power and light weight of computer microprocessors, large-power LED illumination and integrated circuit radiators.

Description

technical field [0001] The invention relates to a core component of a heat dissipation device, in particular to a structure and a manufacturing method of a high-power LED light source heat transfer component used for heating electronic components. Background technique [0002] Most electronic products such as computers, communications, and photoelectric lighting will generate heat when they work. Solving the problem of heat dissipation plays a vital role in the normal operation and life of electronic products. Radiators made of heat columns as core heat transfer components have shown It is a heat dissipation component suitable for the development of new generation electronic products; it has achieved very good results in solving the heat dissipation of integrated single high-power LED lighting sources; in recent years, thermal column products have developed rapidly, but the structure is relatively single, very good There are many deficiencies in the solution to the complete ...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a method for making a heat column. The structure makes the part of the main body of the heat transfer element part that needs to be brazed between the bottom plate and the pipe body set up a cross-section that is rectangular, triangular, arc-shaped, and combinations thereof. Solder isolation measures, wherein the capillary structure in the cavity is sintered copper powder can also effectively ensure that the silver alloy solder passes through the material separation tank without being sucked into the capillary structure in the cavity, greatly improving the welding yield; Leakage problem caused by bad

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