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Flat antenna member and a plasma processing device provided with same

A flat-panel antenna and plasma technology, which is applied in the manufacture of plasma, electrical components, semiconductor/solid-state devices, etc., can solve the problem of difficult to maintain surface wave plasma stably, and achieve the effect of ensuring processing rate and suppressing reflected waves

Inactive Publication Date: 2010-09-29
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, in a large panel antenna component, it is difficult to stably maintain the surface wave plasma even if it is set to the optimum value of the calculated slot length and arrangement and implemented in an actual device.

Method used

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  • Flat antenna member and a plasma processing device provided with same
  • Flat antenna member and a plasma processing device provided with same
  • Flat antenna member and a plasma processing device provided with same

Examples

Experimental program
Comparison scheme
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no. 1 approach

[0030] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 It is a cross-sectional view schematically showing a schematic configuration of the plasma processing apparatus 100 according to the first embodiment of the present invention. also, figure 2 is expressed in figure 1 A plan view of main parts of the flat antenna plate (flat antenna component) according to the first embodiment of the present invention used in the plasma processing apparatus 100 of image 3 It is an enlarged view of a slot serving as a through hole on the flat panel antenna. and then, Figure 4 yes means figure 1 A block diagram of an example of a schematic configuration of a control system of the plasma processing apparatus 100.

[0031] The plasma processing apparatus 100 introduces electromagnetic waves into the processing chamber through a flat plate antenna plate having a plurality of slot-shaped through openings (holes), especi...

no. 2 approach

[0088] Next, refer to Image 6 as well as Figure 7 The planar antenna board 61 in the second embodiment of the present invention will be described. Image 6 It is a top view showing the main part of the planar antenna board 61 of the second embodiment, Figure 7 It is an enlarged plan view showing the grooves on the flat antenna board 61 . The flat antenna plate 61 of this embodiment is used in the plasma processing apparatus 100 similarly to the flat antenna plate 31 of the first embodiment.

[0089] The planar antenna plate 61 has a disc-shaped base material 61a and a plurality of pairs of grooves 62 (62a, 62b) penetrating the base material 61a in a predetermined pattern. The planar antenna board 61 has the same configuration as the planar antenna board 31 of the first embodiment except that the width W2 of each groove 62 is formed large and the number of arranged grooves 62 is reduced. Therefore, in the following description, differences from the first embodiment will ...

no. 3 approach

[0098] Next, refer to Figure 8 A planar antenna board 71 according to a third embodiment of the present invention will be described. Figure 8 It is a plan view showing the main part of the planar antenna board 71 of the third embodiment. The flat antenna plate 71 of this embodiment is used in the plasma processing apparatus 100 similarly to the flat antenna plate 31 in the first embodiment. The planar antenna board 71 has the same configuration as the planar antenna board 61 of the second embodiment except that the number of grooves disposed on the outer peripheral side is increased. Therefore, in the following description, differences from the second embodiment will be mainly described, and descriptions will be omitted for the same components denoted by the same reference numerals.

[0099] The planar antenna plate 71 has a disc-shaped base material 71a and a plurality of grooves 72 ( 72a , 72b1 , 72b2 ) formed through the base material 71a in a predetermined pattern. Th...

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PUM

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Abstract

A flat antenna member in which electromagnetic waves generated by an electromagnetic wave generation source are introduced into the processing container of a plasma processing device, comprising a planar substrate comprising an electro-conductive material and a plurality of through-holes that are formed in the planar substrate and that radiate electromagnetic waves, the through-holes including a plurality of first through-holes arranged in a circle whose center overlaps the center of the flat antenna member, and a plurality of second through-holes arranged concentrically around the first through-holes, having the ratio of L1 for the distance L1 from the center of the flat antenna member to the center of the first through-holes to a radius r of the flat antenna member being in the range of 0.35-0.5, and the ratio L2 / r for the distance L2 from the center of the flat antenna member to the center of the second through-holes to the radius of the flat antenna member being in the range of 0.7-0.85.

Description

technical field [0001] The present invention relates to a planar antenna member for introducing electromagnetic waves of a predetermined frequency into a processing container for performing plasma processing on an object to be processed, and a plasma processing apparatus including the planar antenna member. Background technique [0002] As a plasma processing apparatus for performing plasma processing such as oxidation processing and nitriding processing on a target object such as a semiconductor wafer, it is known to use a planar antenna member having a plurality of grooves to introduce microwaves at a frequency of, for example, 2.45 GHz into a processing container to generate plasma. Plasma processing apparatuses of a bulk type (for example, JP-A-11-260594 and JP-A-2001-223717). In such a microwave plasma processing apparatus, surface wave plasma can be formed in the chamber by generating plasma with a high plasma density. [0003] In the plasma processing apparatus of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05H1/46H01L21/31
CPCH01J37/3222H05H1/46H01J37/32192
Inventor 植田笃足立光田才忠福田良则本乡俊明吉冈正雄
Owner TOKYO ELECTRON LTD