Sealed terminal board anti-gas leakage surface treatment process for high pressure switch

A technology for sealing terminals and high-voltage switches, which can be used in electric switches, surface pretreatment, devices for coating liquid on surfaces, etc., and can solve problems such as air leakage

Inactive Publication Date: 2010-10-13
MOTIC XIAMEN ELECTRIC GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the past, in order to improve the interface effect, sandblasting or knurling treatment was often used on the surface of the metal terminal, but even after the met

Method used

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  • Sealed terminal board anti-gas leakage surface treatment process for high pressure switch
  • Sealed terminal board anti-gas leakage surface treatment process for high pressure switch
  • Sealed terminal board anti-gas leakage surface treatment process for high pressure switch

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Experimental program
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Embodiment Construction

[0033] The anti-air-leakage surface treatment process of the high-voltage switch sealed terminal board of the present invention is to perform sandblasting or knurling treatment on the surface of the metal terminal, and then perform adhesive coating treatment.

[0034] Wherein, performing sandblasting or knurling treatment on the surface of the metal terminal belongs to the prior art, and will not be described in detail herein.

[0035] The key to this case is the coating treatment of the adhesive. The formula of the adhesive used is as follows:

[0036]

[0037] The specific coating process is as follows:

[0038] First weigh 175 parts of methyl ethyl ketone and 175 parts of toluene according to the weight ratio requirements, and then mix them evenly; then pour 100 parts of epoxy resin and 50 parts of phenolic resin weighed according to the weight ratio into methyl ethyl ketone and in the mixed solution of toluene; then stir the mixed solution intermittently at room temper...

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Abstract

The invention discloses a sealed terminal board anti-gas leakage surface treatment process for a high pressure switch. The sealed terminal board anti-gas leakage surface treatment process comprises the following steps of: firstly, carrying out abrasive blasting or knurling treatment on the surface of metal terminals, and then carrying out adhesive coating treatment. An adhesive for use is prepared from the following raw materials in parts by weight: 100 parts of epoxide resin, 50 parts of phenolic resin, 1.5 parts of 2-ethide-4-methylimidazole, 175 parts of ethyl methyl ketone and 175 parts of toluene. The adhesion between the metal terminals and resin materials treated by the invention are greatly improved, and the phenomenon of gas leakage of sealed terminal boards is avoided. In addition, the sealed terminal board does not have gas leakage phenomenon after a cold-hot cycling test, the water pressure intensity is greatly enhanced at the same time, and the gas leakage between the metal terminals and the resin materials are completely avoided.

Description

technical field [0001] The invention relates to an anti-air leakage surface treatment process for a sealed terminal plate of a high-voltage switch. Background technique [0002] GIS (Gas Insulated Switchgear) fully enclosed combined electrical appliances, with their compact structure, wide voltage range, safe and reliable operation, etc., have shown strong vitality in the era when the power industry is increasingly developing towards high voltage and high load density. . As the key insulating part in GIS, epoxy resin insulating castings become the basic elements of GIS insulation reliability. Metal inserts are pre-embedded in epoxy resin insulating castings for GIS, and the interface between metal inserts and epoxy materials has become one of the key links affecting the performance of epoxy resin insulating castings, especially for a large number of applications in GIS sealed terminal strips, such as figure 1 with figure 2 shown. [0003] The metal (outlet) terminals 2...

Claims

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Application Information

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IPC IPC(8): H01H11/00B05D7/14B05D7/24B05D1/38B05D3/00
Inventor 霍利斯·李
Owner MOTIC XIAMEN ELECTRIC GRP
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