Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible printed circuit board

A technology of flexible circuit boards and conductive materials, applied in printed circuits, printed circuits, circuit devices, etc., can solve problems such as inability to transmit high-speed differential signals

Inactive Publication Date: 2010-10-13
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the differential pair 51 is transmitted on the signal layer, common mode noise will be generated because the copper foil grids on the ground layer corresponding to the differential transmission line 52 and the differential transmission line 54 are different, which is why ordinary flexible circuit boards cannot transmit high-speed Reason for Differential Signaling

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible printed circuit board
  • Flexible printed circuit board
  • Flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Please refer to figure 2 A preferred embodiment of the flexible circuit board of the present invention includes a signal layer 10 and two ground layers 30 respectively located above and below the signal layer 10, and an insulating medium is provided between the signal layer 10 and each ground layer 30 Layer 20. Wherein, the relative permittivity of the two insulating medium layers 20 is different, that is, they are composed of two insulating mediums with different properties, and the thicknesses of the two insulating medium layers 20 may be the same or different.

[0012] A differential pair 11 includes two differential transmission lines 12 and 14 and is routed on the signal layer 10 . On each ground layer 30, the part vertically opposite to the differential transmission lines 12 and 14 is hollowed out to avoid the low impedance of the transmission line caused by the vertical distance between the differential pair 11 and the adjacent ground layer 30 being too short ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A flexible printed circuit board comprises at least a signal layer, wherein two grounding layers are respectively arranged above and below the signal layer; two insulation dielectric layers are respectively arranged between the signal layer and the adjacent grounding layers; a differential pair is distributed on the signal layer and comprises two differential transmission lines; the two insulation dielectric layers have different relative dielectric constants; the portions on the grounding layers, which are vertical and opposite to the differential pair, are hollow areas; first horizontal spacing and second horizontal spacing respectively exist between the two edges of the hollow areas on the two grounding layers and the adjacent differential transmission lines and are not equal to each other. Without increasing extra cost, the flexible printed circuit board can be realized only by adjusting the existing wiring way.

Description

technical field [0001] The invention relates to a flexible circuit board, in particular to a flexible circuit board capable of transmitting high-speed differential signals. Background technique [0002] Flexible circuit boards are printed circuit boards made of flexible insulating substrates, which have many advantages that rigid printed circuit boards do not have. For example, the thickness of the flexible circuit board is relatively thin, and it can be bent, wound, and folded freely, and can be arranged arbitrarily according to the requirements of the space layout, and can be moved and stretched arbitrarily in the three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of flexible circuit boards can greatly reduce the size of electronic products, and is suitable for the development of electronic products in the direction of high density, miniaturization, and high reliability. Therefore, flexible circuit boards have been...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/02
CPCH05K1/0219H05K1/024H05K3/4688H05K1/0393H05K1/0253H05K2201/0715H05K1/0245
Inventor 许寿国
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products