LED lamp structure capable of conducting heat by using metal base plate and metal solder

Abstract

The invention discloses an LED lamp structure capable of conducting heat by using a metal base plate and a metal solder, which aims to improve the heat-dissipating performance of a light-emitting diode (LED). The LED lamp structure comprises the metal base plate (1), an epoxy resin printed circuit board (PCB) (2), the LED (4), the solder (8) and a mounting hole (5), wherein the LED has a thermoelectric separation structure and comprises an electric conduction pin (6) and a heat conduction pin (7); a through notch (3) is formed in the PCB; the electric conduction pin (6) of the LED is welded on the PCB (2); the PCB (2) abuts against the metal base plate (1); the LED (4) and the metal base plate (1) are arranged on the two sides of the through notch (3) of the PCB (2) respectively; the solder (8) is welded in the notch (3) of the PCB, so that the heat conduction pin (7) of the LED is connected with the metal base plate (1) through the solder (8); and the heat from the LED (4) is conducted out through the metal solder and the metal base plate sequentially. The LED lamp structure has high heat conductivity, low thermal resistance and long service life; the metal plate is the common commercial copper plate, the common copper plated or sprayed aluminum plate or the common copper plated or sprayed iron plate and is 0.5 to 5 mm thick, so the structure has low cost; and the structure can be widely applied to LED lamps.

Description

technical field [0001] The invention relates to an LED lamp structure, in particular to an LED lamp structure utilizing a metal substrate and metal solder for heat conduction, which is widely used in the lighting field. Background technique [0002] As a new type of light source, LED has the advantages of high luminous efficiency, energy saving, and environmental protection. It will replace incandescent lamps and fluorescent lamps as the fourth-generation light source. At present, the input power of LED can be increased to 5W or even higher, so it is becoming more and more important to accelerate the heat dissipation of LED. If the heat cannot be exported in time, the resulting thermal effect will increase the junction temperature of the LED, reduce the luminous efficiency, red-shift the spectrum, and reduce the quality of parameters such as color temperature and color rendering index, which is even more serious for white LED devices using phosphors. , because the conversio...

AI Technical Summary

Problems solved by technology

The contact between the LED and the PCB board, and then the substrate is often filled with thermally conductive silicone grease or other thermally conductive adhesives for heat conduction, and the silicone oil in the thermally conductive silicone grease will volatilize with the increase of working time and temperature, which will increase the thermal resistance; and Thermally conductive adhesive has large thermal resistance and is easy to age; thereby reducing the heat dissipation effect

The PCB board is often made directly on the metal substrate to form MCPCB to improve the heat conduction effect. MCPCB is not only expensive, but also the thermal resistance is not ideal, so that it cannot meet the needs of lighting.

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