Method and device for regulating current distribution and plasma process equipment

Abstract

The invention discloses a method for regulating current distribution, which is used for regulating current distribution conditions of a first coil and a second coil on a medium window positioned in plasma process equipment. The method comprises the following steps of: 1) setting a current ratio of the first coil to the second coil according to technical requirements; 2) determining an expected regulation capacitance corresponding to the current ratio set in the step 1) according to the current ratio; and 3) regulating the regulation capacitance to the expected value to make the actual ratio of the first coil current to the second coil current reach the set value. In addition, the invention also discloses a device for regulating the current distribution and the plasma process equipment applying the method and / or the device for regulating the current distribution. The method and / or the device for regulating current distribution and the plasma process equipment can accurately and quickly regulate the current distribution conditions of the first coil and the second coil in the plasma process equipment.

Description

technical field [0001] The present invention relates to the technical field of microelectronics, in particular to a method / device for adjusting current distribution. In addition, the present invention also relates to a plasma processing equipment applying the method / apparatus for adjusting current distribution. Background technique [0002] With the rapid development of electronic technology, people have higher and higher requirements for the integration of integrated circuits, which requires companies that produce integrated circuits to continuously improve the processing / processing capabilities of semiconductor devices. At present, in the field of processing / processing of semiconductor devices, plasma etching technology and plasma deposition technology are often required, and these technologies are usually implemented by means of plasma processing devices such as plasma etching machines. [0003] Therefore, in the field of processing / handling of semiconductor devices, the...

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Problems solved by technology

[0015] However, due to current percentage |I1 / (|I1|+|I2 |)|The relationship between the adjustment capacitor C2 is nonlinear, so the above fitting is also nonlinear, which makes the above fitting process more complicated and the fitting accuracy is lower

That is, although it is possible to use the above current percentage |I1 / (|I1|+|I2|)| Describe and adjust the current distribution relationship, however, this method is due to the current percentage |I1 / (|I1|+|I2| )| and the adjustment capacitor C2 are nonlinear, which leads to the inaccurate expected value of the adjustment capacitor C2, and the above-mentioned fitting and adjustment process is complicated and time-consuming, and ultimately affects production efficiency and product quality

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