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Semiconductor laser device

By designing wavelength-dependent photodiodes and optimizing the dielectric multilayer film structure in semiconductor laser devices, the problem of monitoring current fluctuations caused by laser wavelength changes in traditional semiconductor laser devices when the ambient temperature changes is solved, and automatic power control (APC) is realized. The specification of the driver ensures a response to power changes within ±5%.

Active Publication Date: 2010-12-01
SHARP FUKUYAMA LASER CO LTD
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  • Summary
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  • Description
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AI Technical Summary

Problems solved by technology

[0006] However, the fluctuation of the bandgap of the semiconductor laser chip itself due to the change of the ambient temperature causes the wavelength of the laser emitted by it to change.
Therefore, the sensitivity of the photodiode alone is not enough to meet the specifications of the automatic power control (APC, auto power control) drive (the power change caused by the ambient temperature change is within ±5%)

Method used

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Examples

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Embodiment Construction

[0033] figure 1 It is a sectional view of the main part of the semiconductor laser device of the present invention. Semiconductor laser device 10 comprises pedestal (stem) 20, sub-mount (sub-mount) 30, semiconductor laser chip 100 and photodiode 40; On the horizontal plane, the semiconductor laser chip 100 is placed on the submount 30 , and the photodiode 40 is placed on the slope of the base 20 .

[0034] The semiconductor laser chip 100 has an emission surface 100a and a reflection surface 100b, which are opposite end surfaces of the resonator. The photodiode 40 is provided on the reflective surface 100b side, and the light beam emitted from the reflective surface 100b is detected by the light receiving portion 41 of the photodiode 40 . The structure of the semiconductor laser chip 100 and the method of manufacturing the semiconductor laser chip 100 will be described below.

[0035] (manufacturing of laser wafers)

[0036] Figure 2A and 2B as well as Figures 3A to ...

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Abstract

A semiconductor laser device has structure including: a semiconductor laser chip having an emission surface and a reflection surface which are opposing end surfaces of a resonator; and a photodiode for detecting light that exits from the reflection surface side, the photodiode being used in a wavelength band where a sensitivity of the photodiode rises as a wavelength lengthens, in which the emission surface has a first dielectric multilayer film formed thereon and the reflection surface has a second dielectric multilayer film formed thereon, and in which, when a wavelength at which a reflectance of the first dielectric multilayer film peaks is given as [lambda]f and a wavelength at which a reflectance of the second dielectric multilayer film peaks is given as [lambda]r, a relation [lambda]f<[lambda]r is satisfied.

Description

technical field [0001] The present invention relates to a semiconductor laser device including a semiconductor laser chip in which a coating film is formed on an emission surface and a reflection surface which are opposite end surfaces of a resonator. Background technique [0002] A semiconductor laser element used in an optical disc drive generally includes a built-in photodiode for detecting laser power in addition to a semiconductor laser chip, and controls the laser power based on a current value (monitor current) converted by the photodiode through the photoelectric effect. Generally, an inexpensive photodiode using silicon (Si) is used for a 780 nm range semiconductor laser element for CD and a 650 nm range semiconductor laser element for DVD. [0003] Semiconductor laser devices in the 400nm range are used for next-generation Blu-ray disks. However, although the laser power remains constant, the temperature dependence of the semiconductor laser device also causes the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/028
CPCH01S5/0287H01S5/34333H01S5/22H01S5/0202H01S5/0683H01S5/1221H01S5/2009H01S5/02252B82Y20/00H01S5/02326
Owner SHARP FUKUYAMA LASER CO LTD
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