Thermal interface material, electronic device with same and preparation method

Abstract

The invention relates to a thermal interface material which comprises a flexible matrix and a plurality of composite thermal conduction particles distributed in the flexible matrix, wherein each composite thermal conduction particle comprises a first metal particle and at least one carbon nano tube compounded in the first metal particle. In the thermal interface material, the plurality of composite thermal conduction particles are mutually lap jointed to form a thermal conduction channel, thus the material has shorter thermal transfer path; and moreover, because the composite thermal conduction particles have larger grain sizes, thermal resistance among the mutually lap jointed thermal conduction particles is small. The invention also relates to an electronic device with the thermal interface material and a preparation method of the electronic device.

Description

technical field [0001] The invention relates to a thermal interface material, an electronic device with the thermal interface material and a preparation method of the electronic device. Background technique [0002] In recent years, with the rapid development of the integration process of semiconductor devices, the degree of integration of semiconductor devices has become higher and higher, and the volume of devices has become smaller and smaller. However, the reduction in the volume of semiconductor devices has also increased its requirements for heat dissipation. In order to meet the heat dissipation requirements of the semiconductor devices, various heat dissipation methods such as fan heat dissipation, water-cooled auxiliary heat dissipation, and heat pipe heat dissipation are widely used, and certain heat dissipation effects have been obtained. However, because the contact interface between the heat sink and the heat source (semiconductor integrated device, such as CPU)...

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Problems solved by technology

However, the direction of the plurality of carbon nanotubes in the flexible matrix is ​​difficult to control, and the probability that the axial direction of the carbon nanotubes is consistent with the heat transfer direction is very small. Therefore, more carbon nanotubes are required to overlap to form a heat conduction channel. , resulting in a long heat transfer path for the thermal interface material; and, due to the small size of the carbon nanotubes, the thermal resistance between the two overlapping carbon nanotubes is large, and the heat conduction of the carbon nanotubes cannot be effectively utilized. performance

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