Capacitance type microphone without electret layer
A technology of capacitive microphone and electret layer, which is applied in the field of microphones, can solve the problems of not being able to improve performance reliability, not being able to guarantee 100% sensitivity, and unstable performance, etc., to achieve high reliability, good durability, and quality stable effect
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Embodiment 1
[0017] figure 2 (b) is figure 2 One possible integration of (a), figure 2 The driver chip 2, the charge pump 17 and the bias resistor 16 of high resistance value in (a) are integrated in the driver bias chip 18, figure 2 (c) is figure 2 (b) Schematic diagram of the structure of a typical implementation. figure 2 (c) is figure 2 One possible implementation of (b), but not the only one. The chip may not only be a two-wire chip, but also a three-wire, four-wire (typically digital)... .
[0018] Such as figure 2 As shown, a condenser microphone without an electret layer includes: a driver chip 2, a sound channel 3, a metal connection short ring 4, a diaphragm 5, an insulating isolation ring 6, an air gap 7, an electret layer 8, a back Pole plate 9, metal connecting ring 11, metal shell 12, printed circuit board 13, capacitor structure 14, DC blocking capacitor 15, bias resistor 16, charge pump 17, drive bias chip 18.
[0019] One side of the diaphragm 5 is isolated...
Embodiment 2
[0022] Such as image 3 shown, with figure 2 Compared with the shown embodiment 1, only the positions of the capacitor structure 14 and the DC blocking capacitor 15 are exchanged, which is shown in the specific structure as:
[0023] A condenser microphone without an electret layer, comprising: a driver chip 2, a sound channel 3, a metal connection short ring 4, a diaphragm 5, an insulating isolation ring 6, an air gap 7, an electret layer 8, and a back plate 9 , Metal connection high ring 11, metal shell 12, printed circuit board 13, capacitor body structure 14, DC blocking capacitor 15, bias resistor 16, charge pump 17, drive bias chip 18.
[0024] One side of the diaphragm 5 is isolated from the back plate 9 by an insulating spacer ring 6, an air gap 7 is formed between the diaphragm 5 and the back plate 9, the diaphragm 5, the insulating spacer ring 6, the air gap 7 and the back plate 9 form a capacitor structure 14 . The driving bias chip 18 includes the driving chip ...
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