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Method for welding inner conductor of filter and PCB and cavity filter

A cavity filter, PCB board technology, used in waveguide-type devices, welding/welding connections, electrical components, etc., can solve the problems of high product defect rate and difficult to reach products, so as to reduce product defect rate and improve production efficiency. , the effect of reducing production costs

Inactive Publication Date: 2010-12-15
ANHUI TATFOOK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] During the research and practice of the prior art, the inventors of the present invention found that, in the prior art, because the steps processed on the inner conductor are used as the limit, which is attached to the PCB board for welding, strict control is required. PCB board thickness tolerance, inner conductor manufacturing tolerance, and assembly tolerance when assembling the inner conductor on the PCB board, because there are many tolerance indicators to be strictly controlled and distributed in different process links, it is difficult to meet the required height of the product, especially In mass production, the product defective rate is high

Method used

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  • Method for welding inner conductor of filter and PCB and cavity filter
  • Method for welding inner conductor of filter and PCB and cavity filter
  • Method for welding inner conductor of filter and PCB and cavity filter

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Embodiment 1

[0029] Embodiment 1. A welding method for the inner conductor of a filter and a PCB board. Referring to FIG. 2(a) and FIG. Hole 202, including:

[0030] A1, insert the inner conductor 201 into the connection hole 202 on the PCB board 203;

[0031] In this embodiment, an inner conductor is provided. As shown in FIG. The structure can require multiple deformations according to the design of the filter, and its specific implementation does not constitute a limitation to the present invention; a PCB board with connection holes is provided, as shown in Figure 2 (b); the inner conductor 201 is inserted into the PCB The connecting hole 202 on the board 203, as shown in Fig. 2(c) and Fig. 2(d), can be realized by using a designed jig, other tools or manually. The size of the connection hole 202 on the PCB is adapted to the size of the inner conductor 201 .

[0032] A2, as shown in Figure 2(d), adjust the position of the inner conductor so that the distance between the top surface 2...

Embodiment 2

[0047] Embodiment 2, a welding method for the inner conductor of a filter and a PCB board, referring to Fig. 4(a) and Fig. 4(b) together, the PCB board 403 is provided with a connection suitable for the inner conductor 401 Hole 402, including:

[0048] A1, insert the inner conductor 401 into the connection hole 402 on the PCB 403;

[0049] In this embodiment, an inner conductor 401 is provided, including an inner conductor body 441 and an inner conductor connection end 442, as shown in FIG. 4(a); a PCB board 403 with a connection hole 402 is provided, as shown in FIG. As shown in b); Insert the inner conductor 401 into the connection hole 402 of the PCB board 403, as shown in Figure 4(c) and Figure 4(d), it can be realized by using a designed jig, other tools or manually. The size of the connection hole 402 on the PCB is adapted to the size of the inner conductor 401 .

[0050] A2, referring to FIG. 4(e), adjust the position of the inner conductor 401 so that the distance be...

Embodiment 3

[0069] Embodiment 3. A cavity filter, including a cavity, a cover plate, an inner conductor 701, and a PCB board 703. The PCB board has a connection hole for inserting the inner conductor, and the position of the inner conductor 701 is according to The distance between the top surface 712 of the inner conductor and the bottom surface 713 of the PCB is determined.

[0070] The PCB board includes an upper surface 720 of the PCB board and a lower surface 713 of the PCB board, and the inner conductor 701 is inserted into a connection hole from the upper surface 720 of the PCB board, passes out from the lower surface 713 of the PCB board, and passes through the lower surface 713 of the PCB board. position, at least one of the upper surface of the PCB board and the lower surface of the PCB board is welded to the inner conductor to form a welding portion 731 and / or a welding portion 732 . It can be understood that if there is a gap between the inner conductor and the PCB board at the...

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Abstract

The invention discloses a method for welding an inner conductor of a filter and a PCB and a cavity filter. By adjusting the position of the inner conductor first, a distance between the top surface of the inner conductor and the lower surface of the PCB meets the requirement; and the influence of the processing and manufacturing error between the inner conductor and the PCB, the PCB board assembly error and the like on the product required height can be avoided by welding the inner conductor on the PCB. Therefore, that the distance from the top surface of the inner conductor to a reference plane of the filter meets the product requirements is effectively guaranteed.

Description

technical field [0001] The invention relates to the technical field of radio frequency devices, in particular to a method for welding an inner conductor of a filter and a PCB board, and a cavity filter. Background technique [0002] As a frequency selection device, filters are widely used in the field of communication, especially in the field of radio frequency communication. In the base station, the filter is used to select the communication signal and filter out the clutter or interference signal outside the frequency of the communication signal. [0003] At present, cavity filters are commonly used in base station systems. Cavity filters include components such as cavity, cover plate, inner conductor, and PCB board. Some inner conductors are directly soldered to the PCB. Filters usually require the The distance tolerance from the top surface to the filter reference plane is controlled within a narrow range, eg + / -0.15mm. [0004] In the prior art, the following method i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/207H01R4/02H01P11/00
Inventor 孙尚传茹志云
Owner ANHUI TATFOOK TECH CO LTD
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