Through hole plating sub-basket

Abstract

The invention relates to equipment used for manufacturing a printed circuit board (PCB), in particular to a device used in a copper plating process and used for mounting the PCB, and particularly discloses a through hole plating sub-basket which comprises a basket frame (1), a handle (2) and a basket bottom (3). The through hole plating sub-basket is characterized in that the basket (1) is in a quadrangular frame structure formed by ribs, the handle (2) is arranged on fixed ribs (4) at two ends of the top surface of the basket frame (1) and connected with the basket frame (1), and the basket bottom (3) is formed by bottom ribs (5) connected with the basket frame (1). The through hole plating sub-basket has the advantages of simple structure and smaller surface area, can be used for better fixing the PCB through arranging transverse adjusting ribs and longitudinal adjusting ribs and grooves thereon, greatly saves the production cost because fluxes consumed by the surface are less in the use process, and also reduces the cost of post-processing the through hole plating sub-basket.

Description

technical field [0001] The invention relates to a device for manufacturing printed circuits, in particular to a device used in the copper plating process for mounting PCB boards. Background technique [0002] During the production process of printed circuit boards (PCB, referred to as printed boards), it is necessary to plate copper on the hole walls of the pressed and drilled boards to make the originally non-conductive boards conduct up and down, and make the holes conduct The technology is called plated through hole technology, and plated through hole (Plated Through Hole) is called PTH for short. When plating through-holes, it is necessary to put the board to be copper-plated into the through-hole sub-basket (hereinafter referred to as the PTH sub-basket), and the PTH sub-basket carries the board first for pretreatment, mainly to remove slag, and then carry out the PTH process together , the PTH process includes the steps of whole hole in the cleaning tank, micro-etchin...

AI Technical Summary

Problems solved by technology

When plating through-holes, it is necessary to put the board to be copper-plated into the through-hole sub-basket (hereinafter referred to as the PTH sub-basket), and the PTH sub-basket carries the board first for pretreatment, mainly to remove slag, and then carry out the PTH process together , the PTH process includes the steps of whole hole in the cleaning tank, micro-etching in the micro-etching tank, pre-cleaning in the pre-cleaning tank, activation in the activation tank and washing in the corresponding washing tank, and finally electroless copper deposition. While carrying out this series of processes, the PTH sub-basket also carries out the same process together. The current general-purpose PTH sub-basket structure has a larger surface area. The more liquid medicine, especially the relatively high cost of some liquid medicine such as the activator in the activation tank, so the existing PTH sub-basket structure is not conducive to saving the production cost

On the other hand, after the PTH sub-basket is copper-plated with the board, it must be post-processed before it can be reused. The larger the surface area of ​​the PTH sub-basket, the greater the workload of post-processing, which not only increases the processing cost, but also reduces the work. efficiency

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