Radiant heat structure for pin type power led

A technology of light-emitting diodes and heat dissipation structures, which is applied in the direction of circuit heating devices, printed circuits, electrical components, etc., and can solve problems such as reducing light-emitting diode chips

CN101952983BInactive Publication Date: 2012-05-23KOHA CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2012-05-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

This invention relates to a radiant heat structure for a pin type power LED which is used in an automobile, a lamp, an advertisement board, etc. The configuration of the radiant heat structure includes: an LED device; a first lead frame that is electrically connected to the LED device, and has plural leads extended toward a substrate to supply electric power to the LED device; a second lead framewhich faces the first lead frame and has plural leads extended toward the substrate; a molding part, where the upper portions of the first and second lead frames are molded with a transparent material, and wherein the LED device is included; and a heatsink which receives the heat from the LED device and radiates the heat to the outside by being connected to the leads of the first lead frame. Eachlead of the first and second lead frames passes through the space between the molding part and the substrate. The radiant heat structure radiates generated heat to the outside efficiently through a lead frame connected to an LED chip so that the durability of components may be extended and the characteristic change of components caused by heat may be minimized. In addition, it is expected that radiation efficiency can be improved and the application of current can be increased. Furthermore, the fabrication cost can be remarkably reduced since the radiant heat structure is applicable to an existing LED fabricating process.
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Description

Technical field

[0001] The present invention relates to a pin-type high-power light-emitting diode heat dissipation structure used in automobiles, lighting, billboards, etc., and more particularly to a pin-type high-power light-emitting diode heat dissipation structure characterized by: being connected to The lead frame of the LED chip effectively dissipates the heat generated to extend the service life of the components and components, minimize the characteristic changes of the components, enhance the current injection, improve the luminous efficiency, and reduce the cost of the previous LED manufacturing project unprecedentedly. Background technique

[0002] A light emitting diode (LED) is a semiconductor p-n combination element, and also a light emitting semiconductor that can convert electrical energy into light energy. Generally, the operating principle of light-emitting diodes is as follows: current flows when voltage is injected between the terminals, and emits light by co...

Examples

Embodiment Construction

[0059] The preferred embodiments of the present invention will be described in detail below with reference to the drawings.

[0060] figure 1 Is a separated oblique view of the present invention, figure 2 Is a longitudinal sectional view of the present invention, image 3 Yes figure 2 Floor plan.

[0061] Such as Figure 1 to Figure 3 As shown, the pin-type high-power light-emitting diode heat dissipation structure of the present invention includes a light-emitting diode element 1, electrically connected to the light-emitting diode element 1, and is provided with a plurality of wires 5 extending along the direction of the substrate 3 to connect to the light-emitting diode element 1. A first lead frame 7 for supplying power, a second lead frame 6 facing the first lead frame 7 and provided with a plurality of wires 5'extending along the substrate 3, containing the light-emitting diode element 1 and the upper side molds of the first and second lead frames 7, 6 are molded into a tran...