Radiant heat structure for pin type power led

Abstract

This invention relates to a radiant heat structure for a pin type power LED which is used in an automobile, a lamp, an advertisement board, etc. The configuration of the radiant heat structure includes: an LED device; a first lead frame that is electrically connected to the LED device, and has plural leads extended toward a substrate to supply electric power to the LED device; a second lead framewhich faces the first lead frame and has plural leads extended toward the substrate; a molding part, where the upper portions of the first and second lead frames are molded with a transparent material, and wherein the LED device is included; and a heatsink which receives the heat from the LED device and radiates the heat to the outside by being connected to the leads of the first lead frame. Eachlead of the first and second lead frames passes through the space between the molding part and the substrate. The radiant heat structure radiates generated heat to the outside efficiently through a lead frame connected to an LED chip so that the durability of components may be extended and the characteristic change of components caused by heat may be minimized. In addition, it is expected that radiation efficiency can be improved and the application of current can be increased. Furthermore, the fabrication cost can be remarkably reduced since the radiant heat structure is applicable to an existing LED fabricating process.

Description

Technical field [0001] The present invention relates to a pin-type high-power light-emitting diode heat dissipation structure used in automobiles, lighting, billboards, etc., and more particularly to a pin-type high-power light-emitting diode heat dissipation structure characterized by: being connected to The lead frame of the LED chip effectively dissipates the heat generated to extend the service life of the components and components, minimize the characteristic changes of the components, enhance the current injection, improve the luminous efficiency, and reduce the cost of the previous LED manufacturing project unprecedentedly. Background technique [0002] A light emitting diode (LED) is a semiconductor p-n combination element, and also a light emitting semiconductor that can convert electrical energy into light energy. Generally, the operating principle of light-emitting diodes is as follows: current flows when voltage is injected between the terminals, and emits light by co...

AI Technical Summary

Problems solved by technology

[0025] In order to solve the above problems, the present invention provides a heat sink (HEAT SINK) of a pin-type light-emitting diode (PIN TYPE LED) characterized by the following content, which is characterized in that: the heat generated when the light-emitting diode is lighted cannot be resolved to the greatest extent. Injecting more than a certain amount of current reduces the reliability of the LED chip (LED CHIP) performance and is easy to apply to various fields and directly applied to existing packaging products, and guarantees mass production and improves through the minimum investment and compatibility. Affordable

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