Applying/developing apparatus and applying/developing method

Abstract

The present invention provides a coating and developing device and a coating and developing method capable of shortening the moving distance of a wafer transfer arm, shortening the processing time, and reducing the occupied space. The coating and developing device has a liquid processing unit (COTU), which includes: a liquid processing unit (COT) that uses a chemical solution to perform liquid processing on the substrate; A section (CA); and a heat treatment section (HP) provided corresponding to the cooling treatment section (CA) for heating the substrate. The cooling processing unit (CA) has a substrate transfer function for transferring substrates between itself and the liquid processing unit (COT) and between the heating processing unit (HP).

Description

technical field [0001] The invention relates to a coating and developing device and a coating and developing method for performing liquid treatment on a substrate by using a chemical solution. Background technique [0002] In the photolithography process in the manufacturing process of semiconductor devices, after the surface of the semiconductor substrate (hereinafter referred to as "substrate" or "wafer") is hydrophobized, BARC (Bottom Anti-Reflective Coating, bottom anti-reflective coating) is applied. Layer) and heat treatment, resist coating and heat treatment, exposure treatment, development treatment and removal of the solubilized part, thereby forming a fine resist pattern. [0003] Here, in the process before exposure of the resist pattern, coating treatment of coating BARC, heat treatment (prebaking) for evaporating the solvent in the coated BARC liquid, and cooling treatment (cooling) are continuously performed. , resist coating treatment for coating a resist on ...

AI Technical Summary

Problems solved by technology

[0009] In the case where a common wafer transfer arm is arranged in the center, the number of transfers of wafers between the processing units arranged in the upper and lower multiple stages on both sides is large, the moving distance of the wafer transfer arm becomes longer, and the processing time increases, which cannot The problem of increasing the number of wafers processed per unit time

[0010] In addition, since there is only one wafer transfer arm in the center, it is difficult to share and assemble each processing unit that has the function of processing a specific wafer, and there is a problem that the occupied space cannot be reduced.

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