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Method for manufacturing package, method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece

A piezoelectric vibrator and a manufacturing method technology, applied in the field of radio clocks, can solve the problems of discharge, current flow and scattering required for anodic bonding, etc., and achieve the effects of high quality and suppression of discharge phenomenon

Inactive Publication Date: 2015-07-01
SEIKO INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the above-mentioned conventional method of manufacturing the piezoelectric vibrator, when anodic bonding is performed, the through-electrode 205 is in contact with the electrode seat portion 208 and is in contact with the through-electrode The piezoelectric vibrating reed 203 electrically connected to 205 is close to the bonding film 207, so when a bonding voltage is applied between the bonding film 207 and the electrode seat 208, a discharge phenomenon may occur between the bonding film 207 and the piezoelectric vibrating reed 203 ( spark discharge)
[0009] Furthermore, when such a discharge phenomenon occurs, there is a problem that the current does not flow sufficiently between the base substrate 201 and the bonding film 207, However, the base substrate 201 and the bonding film 207 are not anodically bonded.
Moreover, even if a single discharge phenomenon occurs, for example, the bonding film 207 is peeled off and scattered, and since the scattered bonding film 207 adheres to the piezoelectric vibrating reed 203 or the like, a discharge is generated between the bonding film 207 and the piezoelectric vibrating reed 203 . path, it is difficult to pass the current required for anodic bonding between the base substrate 201 and the bonding film 207

Method used

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  • Method for manufacturing package, method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece
  • Method for manufacturing package, method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece
  • Method for manufacturing package, method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece

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Embodiment Construction

[0054] Hereinafter, a piezoelectric vibrator according to an embodiment of the present invention will be described with reference to the drawings.

[0055] Such as Figure 1 to Figure 4 As shown, the piezoelectric vibrator 1 of this embodiment is a surface-mounted piezoelectric vibrator including a package 9 including a base substrate 2 stacked so as to form a cavity C therebetween and a piezoelectric vibrating piece 4 . The piezoelectric vibrating piece 4 is accommodated in the cavity C and is electrically connected to lead-out electrodes (internal electrodes) 36 and 37 described later.

[0056] Also in image 3 and Figure 4 In the figure, illustration of the excitation electrode 15 , lead-out electrodes 19 and 20 , mounting electrodes 16 and 17 , and weight metal film 21 of the piezoelectric vibrating reed 4 is omitted for convenience of illustration.

[0057] (Piezoelectric vibrating piece)

[0058] Such as Figure 5 to Figure 7 As shown, the piezoelectric vibrating p...

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Abstract

Providing a method for manufacturing a package capable of suppressing occurrence of a discharge phenomenon during the anodic bonding and achieving stable anodic bonding of the base board and the bonding film. Providing a method for manufacturing a package including: an alignment step where an inner surface of the lid board 50 is superimposed onto an inner surface of the base board 40, and an outer surface of the base board 40 is disposed on an electrode base portion 70 for anodic bonding; and an anodic bonding step where a bonding voltage is applied between the bonding film 35 and the electrode base portion 70 while heating them to a bonding temperature, whereby the bonding film 35 and the base board 40 are anodically bonded, wherein the anodic bonding step involves applying the bonding voltage in a state where the penetration electrodes 32, 33 are exposed to a void portion 73 formed in the electrode base portion 70.

Description

technical field [0001] The present invention relates to a method of manufacturing a package, a method of manufacturing a piezoelectric vibrator, a piezoelectric vibrator manufactured by the manufacturing method, an oscillator including the piezoelectric vibrator, electronic equipment, and a radio clock. Background technique [0002] In recent years, piezoelectric vibrators using crystals or the like as a time source, a timing source such as a control signal, a reference signal source, and the like have been used in mobile phones and portable information terminal devices. [0003] As such a piezoelectric vibrator, a surface mount type (SMD: Surface Mount Device) piezoelectric vibrator as disclosed in Patent Document 1 below is known, for example. Such as Figure 21 and Figure 22 As shown, the piezoelectric vibrator 200 includes: a base substrate 201 and a lid substrate 202 bonded to each other; and a piezoelectric vibrating piece 203 sealed in a cavity C formed between the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H3/02H03H9/02H03H9/17G04R20/00H01L23/02H03B5/32H03H9/19H03H9/215
CPCH03H9/1021H03H9/21Y10T29/42Y10T29/49126Y10T428/24612
Inventor 杉山刚
Owner SEIKO INSTR INC