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TCP type semiconductor device

A semiconductor and device technology, applied in the field of TCP type semiconductor devices and their testing, can solve problems such as reducing probes, and achieve the effect of reducing manufacturing costs

Inactive Publication Date: 2011-04-06
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since it is necessary to secure insulating properties between adjacent probes, there is a limit to reducing the pitch between the tips of the probes

Method used

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  • TCP type semiconductor device
  • TCP type semiconductor device
  • TCP type semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] A TCP type semiconductor device according to the present invention will be described in detail with reference to the accompanying drawings.

[0036] 1. Structure

[0037] figure 2 The configuration of the TCP type semiconductor device according to the present embodiment is schematically shown. A base film (carrier tape) 10 such as a TAB tape is used in a TCP type semiconductor device. Such as figure 2 As shown in , the width direction and extension direction of the base film 10 are along the x direction and the y direction, respectively. The x-direction and the y-direction are along mutually perpendicular directions.

[0038] A plurality of semiconductor chips 20 are mounted on the base film 10 . More specifically, base film 10 has a plurality of device regions RD sequentially positioned along the y direction. Each of the device regions RD is a region surrounded by dicing lines CL on the base film 10 . The plurality of semiconductor chips 20 are located inside ...

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PUM

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Abstract

A TCP type semiconductor device includes a base film; a semiconductor chip mounted on the base film; and a plurality of leads formed on the base film and electrically connected with the semiconductor chip. Each of the plurality of leads has an external terminal portion exposed externally. The external terminal portion of the each lead includes: a first portion having a first thickness; and a second portion having a second thickness which is thinner than the first thickness. The first portion and the second portion are arranged to oppose to each other between adjacent two of the plurality of leads.

Description

technical field [0001] The invention relates to a semiconductor device and a testing method thereof. In particular, the present invention relates to a TCP (Tape Carrier Package) type semiconductor device and a testing method thereof. Background technique [0002] Probe cards are known for testing of semiconductor devices. The probe card includes a large number of probes that come into contact with test terminals of a test object. Therefore, the test is performed by bringing the tip of each of the probes into contact with the corresponding test terminal, supplying a test signal from the tester to the test object through the probe card, and obtaining an output from the test object signal of. Meanwhile, in order to prevent short-circuit faults, it is required to accurately contact the probes with the corresponding test terminals. [0003] On the other hand, in recent years, the pitch between test terminals has become narrower due to miniaturization of semiconductor devices ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/49
CPCH01L23/49548H01L23/4952H01L2924/0002H01L23/49541H01L22/32H01L23/49572H01L2924/00
Inventor 佐佐木卓村上弘治
Owner RENESAS ELECTRONICS CORP