Plating equipment and plating method for electronic antenna
A technology for electroplating equipment and antennas, applied in the direction of electrodes, etc., can solve the problems of electroplating electronic antennas with tails, easy to be electroplated, etc., to achieve the effect of simple and convenient plating operation, reasonable process design, and solving the effect of easy electroplating of electrodes
Active Publication Date: 2014-01-15
BEIJING XINGHAN SPECIAL PRINTING
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Problems solved by technology
[0002] Use the electroplating process to make tag antennas. The principle of this process is to select a substrate, print the guiding ink layer of the antenna according to the design, and then plate the required thickness of copper; compared with the traditional etching process, the product performance is superior; Compared with pure printing, there is greater cost saving, and the process is easy to control; after electroplating, the product can be directly assembled and bonded, but the current electroplating process will cause the electroplating electronic antenna to be separated from the connecting wire and then electroplate the electronic antenna strip The problem of the tail and the problem that the electrode is easy to be plated
Method used
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[0023] Such as Figure 1-3 As shown, it is a schematic diagram of the structure of the plating device and the plating base material of the present invention, and the electroplating method of the electronic antenna of the present invention comprises the following steps:
[0024] (1) Print antenna pattern 1, main wire 2, guidance wire 3 and connection wire 4 with conductive ink on the plated base material; The plating advance direction of the base material 8 is continuous, and the guide wire 3 is located inside the main wire 2 and is discontinuous along the plating advance direction of the plated base material 8, and the main wire 2 and the guide wire 3 are connected by Line 4 is connected; Antenna pattern 1 is located between two sections of guidance lines;
[0025] (2) drying the plated substrate 8 in the step (1);
[0026] (3) The dried plated substrate 8 is wound on a conductive roller for electroplating.
[0027] The length of each guide line 3 is equal to the width of t...
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The invention discloses plating equipment and a plating method for an electronic antenna, which are characterized in that: an antenna pattern, a main wire, auxiliary wires and a connecting wire are printed on a plated substrate by using conductive ink; the main wire is positioned on two side edges of the plated substrate and is continuous along a plating forward direction of the plated substrate, the auxiliary wires are positioned on the inner side of the main wire and are intermittent along the plating forward direction of the plated substrate, and the main wire is connected with the auxiliary wires through the connecting wire; the antenna pattern is positioned between two sections of auxiliary wires; the dried plated substrate is wound on a special conducting roller to be plated; and a conductive electrode of the conducting roller is a flaky conductive material and only the end face touching the plated substrate is not coated with an insulating material, the conductive electrode is fixed on an insulating support at equal intervals and two auxiliary wires positioned at two ends of the antenna pattern are communicated through the conductive electrode. The process has a rational design, the plating can be operated easily and conveniently, the problem that the conventional plated electronic antenna is provided with a tail is solved, and the problem that the electrode is easy to plate is also solved.
Description
technical field [0001] The invention relates to the field of material electroplating, in particular to an electroplating device and an electroplating method for an electronic antenna. Background technique [0002] Use the electroplating process to make tag antennas. The principle of this process is to select a substrate, print the guiding ink layer of the antenna according to the design, and then plate the required thickness of copper; compared with the traditional etching process, the product performance is superior; Compared with pure printing, there is greater cost saving, and the process is easy to control; after electroplating, the product can be directly loaded with chips and bonded, but the current electroplating process will cause the electroplating electronic antenna to be separated from the connecting wire and then electroplate the electronic antenna strip The problem of the tail and the problem that the electrode is easy to be plated. Contents of the invention ...
Claims
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IPC IPC(8): C25D5/04C25D5/02C25D7/06C25D17/12
Inventor 郭继光常林桐
Owner BEIJING XINGHAN SPECIAL PRINTING