Inorganic adhesive for metal adhesion
A technology of inorganic glue and metal glue, applied in the direction of inorganic adhesives, adhesives, etc., can solve the problem of high production cost
Inactive Publication Date: 2011-04-20
邵华
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AI Technical Summary
Problems solved by technology
[0002] The existing adhesives generally have certain deficiencies in the working effect, and the production cost is also relatively high
Method used
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Embodiment 1
[0015] An inorganic adhesive for metal bonding, which is composed of the following components by weight percentage:
[0016]
Embodiment 2
[0018] An inorganic adhesive for metal bonding, which is composed of the following components by weight percentage:
[0019]
[0020]
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Description
technical field [0001] The present invention relates to an adhesive. Background technique [0002] Existing adhesives generally have certain deficiencies in working effect, and the production cost is also relatively high. Contents of the invention [0003] The object of the present invention is to provide an inorganic glue with reasonable formula and good working effect for metal bonding. [0004] Technical solution of the present invention is: [0005] An inorganic glue for metal bonding is characterized in that it is composed of the following ingredients in weight percentage: [0006] [0007] The inorganic glue used for metal bonding is composed of the following components by weight percentage: [0008] [0009] [0010] The inorganic glue used for metal bonding is composed of the following components by weight percentage: [0011] [0012] The invention has reasonable formula, good working effect and low production cost. [0013] The present invention ...
Claims
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Inventor 邵华
Owner 邵华



