Method for reducing reflection power in plasma etching

Abstract

The invention discloses a method for reducing reflection power in plasma etching. The method comprises the following steps of: performing a stabilization process, performing a transformation process, an insulating antireflection layer etching process, an adhesive layer removing process, a main etching process, a bottom adhesive layer removing process, an over-etching process and a charge releasing process on a wafer to be etched in turn; and etching a metal layer of the wafer. By the method, the reflection power can be effectively reduced, and the yield of a product is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for reducing reflected power in plasma etching. Background technique [0002] In the manufacturing process of large-scale integrated circuits (ICs), with the continuous increase of the integration level of integrated circuits, the area of ​​semiconductor elements is gradually reduced, and the design line width of integrated circuits is also getting smaller and smaller. In the prior art, an etching method is generally used to form an extremely fine-sized circuit structure on a semiconductor element, and plasma etching is one of the most commonly used etching methods. [0003] In the plasma etching, a group of high-power radio frequency excitation power sources are generally used to make the etching gas in the reaction chamber generate a glow discharge under the action of a high-frequency electric field (frequency is usually 13.56 MHz), so that the etching gas T...

AI Technical Summary

Problems solved by technology

Due to the great change in the environmental conditions in the above-mentioned reaction chamber, the components of the reaction chamber itself cannot be adjusted accordingly (turning) and feedback, resulting in increased reflected power

When the reflected power is too large, the polymer on the reaction chamber may be bombarded and fall on the wafer, causing the logic circuit on the semiconductor device to be short-circuited or disconnected, thereby causing the product to be scrapped and greatly reducing the quality of the product. yield

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