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Screen and method for forming protective layer on back of wafer

A technology of stencil and wafer, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of high stress on the protective layer, fragile chips, and difficult processing, so as to improve strength, ensure safety, reduce The effect of stress

Active Publication Date: 2013-03-13
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The invention provides a stencil to solve the problem that the existing stencil formed by the protective layer has a large internal stress, which easily causes the wafer to bend, making it difficult to process in the subsequent manufacturing process, and the wafer is very easy to break

Method used

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  • Screen and method for forming protective layer on back of wafer
  • Screen and method for forming protective layer on back of wafer
  • Screen and method for forming protective layer on back of wafer

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Embodiment Construction

[0034] It has been mentioned in the background technology that since the printing holes of the existing screen are of the same size as the wafer, the protective layer formed by the existing screen is a whole, and its area is the same as that of the wafer, which makes During the curing process of the insulating material, there is a large stress inside the insulating material, which makes the wafer easy to bend, which is very difficult to process in the subsequent manufacturing process, and the wafer is easily broken, which brings huge losses to the process production.

[0035] The core idea of ​​the present invention is to provide a stencil, which can reduce the internal stress of the insulating material during the curing process and ensure that the wafer will not be bent.

[0036] The present invention will be described in more detail below in conjunction with cross-sectional schematic diagrams, wherein preferred embodiments of the present invention are shown, and it should be ...

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Abstract

The invention discloses a screen, which is used for coating an insular material on the back of a wafer and comprises a frame, a printing hole formed on the frame and a printing net arranged on the printing hole, wherein the printing net is matched with the wafer. The screen can reduce the internal stress of the insular material in a curing process and guarantee that the wafer is not bent, so that the strength of the wafer is improved.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a screen and a method for using the screen to form a protective layer on the back of a wafer. Background technique [0002] In recent years, since the microcircuit manufacturing of chips is developing toward high integration, the chip packaging also needs to develop in the direction of high power, high density, thinness and miniaturization. Chip packaging means that after the chip is manufactured, the chip is wrapped in plastic or ceramic materials to protect the chip from external moisture and mechanical damage. The main functions of chip packaging include power transmission, signal transmission, heat dissipation and protection support. Since the requirements of today's electronic products are light, thin, small and highly integrated, the number of logic circuits contained in the chip increases, which further increases the number of I / O (Input / Output) pins of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/31
Inventor 何智清丁万春王重阳
Owner SEMICON MFG INT (SHANGHAI) CORP