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Vaccum processing apparatus

A vacuum processing device and vacuum chamber technology, which is applied in the manufacture of discharge tubes, electrical components, semiconductors/solid-state devices, etc., can solve the problems of reduced consistency and high plasma flux, and achieve the effect of improving consistency

Active Publication Date: 2011-04-27
WONIK IPS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] If the plasma flux around the edge of the substrate is high due to the "edge effect", especially when high power is applied to the substrate in metal processing or when processing large substrates, the substrate's Deposition or etch treatments at the edges may produce reduced uniformity

Method used

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  • Vaccum processing apparatus
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Embodiment Construction

[0043] The present invention will now be described in detail with reference to the accompanying drawings.

[0044] The vacuum processing apparatus according to the present invention will be explained in more detail below with reference to the accompanying drawings.

[0045] Figure 3A is a cross-sectional view of a vacuum processing device according to the present invention, Figure 3B is a longitudinal sectional view of a vacuum processing apparatus according to the present invention, and Figure 4 is shown Figure 3A Graphical illustration of the etch rate of the vacuum processing apparatus.

[0046] Such as Figure 3A and 3B As shown, the vacuum processing apparatus according to the present invention includes a vacuum chamber 100 having a processing space, and a substrate supporting unit 140 installed in the vacuum chamber 100 .

[0047] The substrate 1 to be vacuum-treated may include any object requiring vacuum treatment such as etching treatment and deposition trea...

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Abstract

A vacuum processing device is provided.The apparatus can realize the substrate vacuum processing (such as etching and depositing) to a glass substrate, for example, liquid crystal display (LCD) panel. The vacuum processing device includes a vacuum chamber having a processing space; a rectangular substrate support installed in the vacuum chamber; an electrostatic chuck installed in an upper part of the substrate support; and at least one shield member closing an edge of the electrostatic chuck. A vertex of a substrate support surface is formed by the electrostatic chuck and the shield member. The vertex of the substrate support surface is extended to the inner wall of the vacuum chamber by a support surface extending unit. Therefore, the apparatus can prevent an edge effect in a vertex of a substrate, thereby improve the uniformity of etching rate or depositing rate on a substrate.

Description

technical field [0001] The present invention relates to a vacuum processing apparatus, and more particularly, to a vacuum processing apparatus capable of performing vacuum processing (such as etching processing and deposition processing) with respect to substrates such as glass substrates for liquid crystal display (LCD) panels. Background technique [0002] In general, a vacuum processing apparatus is involved in performing vacuum processing such as etching processing and deposition processing with respect to the surface of a substrate mounted on a substrate supporting unit. In the vacuum processing apparatus, when energy is applied to the vacuum chamber, plasma is formed in the vacuum chamber having the vacuum processing space therein. [0003] Figure 1A is a cross-sectional view of a vacuum processing apparatus according to conventional techniques, and Figure 1B yes Figure 1A Longitudinal sectional view of the vacuum processing device. [0004] In a conventional vacu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/683
CPCH01J37/32082H01J37/32532H01J37/32633H01J37/32715H01L21/6831
Inventor 曺生贤金娧永
Owner WONIK IPS CO LTD