Unlock instant, AI-driven research and patent intelligence for your innovation.

TO-CAN coaxial small-sized packaging method for PIN-FET high-sensitivity detector

A PIN-FET and TO-CAN technology, which is applied in the field of semiconductor optoelectronic device manufacturing, can solve problems such as the inability to meet the requirements for miniaturization of fiber optic gyroscopes.

Inactive Publication Date: 2012-09-19
江苏飞格光电有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the requirements for miniaturization of inertial navigation fiber optic gyroscope are getting higher and higher, and the existing optoelectronic devices cannot meet the requirements of miniaturization of the overall volume of fiber optic gyroscope.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] The method of the embodiment of the present invention is:

[0011] a. The surface of the TO-CAN base made of iron-nickel-cobalt alloy material is plated with gold, and the ceramic heat sink is welded to the TO-CAN base with epoxy resin solder, and the heat conduction is set on the TO-CAN base welded with the ceramic heat sink Node;

[0012] b. Using thin film sputtering process to plate gold on the surface of ceramic heat sink;

[0013] c. Weld the integrated chip, detector PD chip, and filter capacitor to the TO-CAN base with conductive epoxy solder;

[0014] d. Carry out gold wire welding and connect the connecting wires outside the chip.

[0007] c. Weld the integrated chip, detector PD chip, and filter capacitor to the TO-CAN base with conductive epoxy solder;

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method for manufacturing a semiconductor photoelectric device for an inertial navigation system, in particular to a TO-CAN coaxial small-sized packaging method for a PIN-FET high-sensitivity detector. The method comprises the following steps that: a, the surface of a TO-CAN base made of an iron, nickel and cobalt alloy material is gilded and a heat-conductive Case point is arranged on a TO-CAN base welded with a ceramic heat sink; b, the surface of the ceramic heat sink is gilded by a thin-film sputtering method, and the ceramic heat sink is welded on the TO-CAN base by epoxy resin solder; c, an integrated chip, a detector PD chip and a filter capacitor are welded on the TO-CAN base by the epoxy resin solder; and d, a connecting chip is connected with an external connecting lead by welding a gold wire. Three fragmented components of FET, PNP and NPN are integrated on a chip, so that the device small in size is conveniently packaged into a TO-CAN coaxial small-sized device, and has the advantages of small size and low power consumption compared with the device packaged by the traditional butterfly packaging method.

Description

technical field [0001] The invention relates to the manufacture of semiconductor optoelectronic devices used in inertial navigation systems, in particular to a TO-CAN coaxial miniaturized packaging method for PIN-FET high-sensitivity detectors. Background technique [0002] At present, the miniaturization requirements for inertial navigation fiber optic gyroscopes are getting higher and higher, but the existing optoelectronic devices cannot meet the requirements for the miniaturization of the overall volume of fiber optic gyroscopes. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a TO-CAN coaxial miniaturization packaging method of a PIN-FET high-sensitivity detector that can reduce the volume of the photoelectric device and reduce power consumption. [0004] The method of the present invention is: [0005] a. Gold-plate the surface of the TO-CAN base made of iron-nickel-cobalt alloy material, use epoxy resin s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L31/18
Inventor 詹敦平
Owner 江苏飞格光电有限公司