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Demolding film

A release film and polyester-based technology, applied in chemical instruments and methods, layered products, synthetic resin layered products, etc., can solve problems such as poor heat resistance and mold release

Active Publication Date: 2011-05-11
UNITIKA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface layer resin cannot be crystallized positively because the moldability is important. Therefore, there are problems of poor heat resistance and mold release properties in the case of high-temperature hot pressing as in the application of the present invention.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0139] Using two independent extruders, A-2 as the (A) layer resin, and B1-1 and B2 as the (B) layer resin are supplied at a mass ratio of 40 / 60, and are supplied separately. The resins were all melt-kneaded at 260°C. The melts were merged and laminated into three layers of A / B / A before reaching the outlet of the T-shaped die, extruded through the outlet of the T-shaped die, and cooled by the casting roll adjusted to 80°C to obtain A laminated film having a layer thickness of A / B / A=20 / 60 / 20 (µm). The time for close contact with the casting roll was 4 seconds.

Embodiment 2～12

[0140] [Examples 2-12, Comparative Examples 1-5]

[0141] Compared with Example 1, the resins used in the (A) layer and (B) layer, the compounding ratio of (B1) (B2) in the B layer, and the layer thickness configuration were changed as shown in Tables 1 to 3. . Examples 2-7, Example 10, Comparative Examples 1-5 were melted at 260° C., and Examples 8-9 were respectively melted and extruded from the T-shaped die outlet at 280° C. The extruded resin was brought into close contact with casting rolls adjusted to the temperatures shown in Tables 1 and 3. Other conditions were the same as in Example 1, and two types of three-layer laminated films having a composition of A / B / A were obtained. The time for close contact with the casting roll was 4 seconds.

Embodiment 13

[0143] Using two independent extruders, A-2 as the (A) layer resin, and B1-1 and B2 as the (B) layer resin are supplied at a mass ratio of 40 / 60, and are supplied separately. The resins were all melt-kneaded at 260°C. The melts are merged and laminated into two layers of A / B before reaching the outlet of the T-shaped die, extruded through the outlet of the T-shaped die, and cooled by the casting roll adjusted to 80°C to obtain the layer thickness It is a laminated film of A / B=30 / 60 (μm). The time for close contact with the casting roll was 4 seconds.

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Abstract

The invention discloses a demolding film, which comprises a polyester elastic member (A) layer arranged at the surface thereof and a polyester (B) layer.The glass transition temperature of the polyester elastic member (A) is 0 to 20 DEG C and the crystallization speed index thereof is 20 to 50 DEG C.The polyester (B) comprises a crystalline aromatic polyester (B1) and 1,4-cyclohexanedimethanol copolymer polyterephthalic acid glycol ester (B2) and the mass ratio of (B1) to (B2) is within the range of 5 / 95 - 50 / 50.The glass transition temperature of the polyester (B) is 40 to 80 DEG C and the crystallization melting heat thereof is 5-40 J / g.

Description

technical field [0001] The present invention relates to a release film, and particularly relates to a release film used when producing a printed circuit board. In particular, it relates to a release film useful when a cover film is bonded by thermosetting adhesive at high temperature to a printed substrate having a precise pattern. Background technique [0002] Release films are widely used in industry. Especially in the manufacturing process of printed circuit boards, flexible printed circuit boards, multilayer printed wiring boards, etc., when hot-pressing copper clad laminates or copper foils through preforms or heat-resistant films, it is used to prevent preforms, The heat-resistant film is bonded to the heat-pressed plate. Furthermore, in the manufacturing process of the flexible printed circuit board, when the cover film is thermocompression-bonded on the flexible printed circuit board body on which the circuit is formed with the thermosetting adhesive, it is used to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/36
Inventor 涩谷健二南条一成西村弘
Owner UNITIKA LTD