Tungsten and molybdenum copper alloy heat sink material and preparation method

Abstract

The invention relates to improvement on a tungsten and molybdenum copper alloy heat sink material, which is characterized in that: a plurality of Z-direction through holes are formed on a tungsten copper alloy plate, and copper cores which are level with two surfaces of the plate are riveted into the through holes, so that the coefficient of linear expansion of the heat sink material is between 6 an 8 ppm / DEG C, and compared with the heat sink material on which the copper cores are not riveted, the heat conductivity of the heat sink material is at least increased by over 10 percent. Compared with the heat sink material on which the copper cores are not riveted, the Z-direction heat conductivity is improved greatly, and the heat of an encapsulation internal surface of a substrate can be conducted to an encapsulation external surface quickly, so that the heat is dispersed quickly; compared with the heat sink material on which the copper cores are not riveted, the heat conductivity of the heat sink material is at least increased by over 10 percent, so the heat sink material is favorable for realizing the miniaturization and high power of miniaturization devices; and a riveting form for forming core columns can ensure gas tightness, and the leakage rate of sample tests is less than or equal to 5*10<9>Pa / m<3> / s. The tungsten and molybdenum copper alloy heat sink material has a simple preparation method, and can realize industrial production.

Description

technical field [0001] The invention relates to the improvement of the tungsten-copper alloy heat sink material, in particular to a tungsten-copper alloy heat sink material with a linear expansion coefficient meeting the requirements and high thermal conductivity. Background technique [0002] Tungsten-copper and molybdenum-copper alloy heat sink materials are commonly used in heat sink substrates for high airtight packaging such as CPU, IC, and solid-state microwave tubes. However, its thermal conductivity is still not ideal, so people try to improve it. In order to improve its thermal conductivity and heat dissipation performance, people usually increase the content of copper in it. However, the increase of copper content can improve the thermal conductivity of the alloy heat sink material, but as another performance requirement of the heat sink material, it requires its wire The coefficient of expansion CTE should match the chip as much as possible. However, if the coppe...

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Problems solved by technology

However, its thermal conductivity is still not ideal, so people try to improve it

In order to improve its thermal conductivity and heat dissipation performance, people usually increase the content of copper in it. However, the increase of copper content can improve the thermal conductivity of the alloy heat sink material, but as another performance requirement of the heat sink material, it requires its wire The coefficient of expansion CTE should match the chip as much as possible. However, if the copper content is increased too much, the linear expansion coefficient of the heat sink material will not match the chip. During the long-term thermal expansion and contraction process, it is easy to cause chip damage and failure due to inconsistent thermal expansion.

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