Light-emitting diode encapsulation structure

Abstract

The invention discloses a light-emitting diode (LED) encapsulation structure, which comprises an LED chip, a lead frame and a shell connected on the lead frame, wherein the lead frame comprises a surface for arranging the LED chip; the shell comprises an inner wall for closing and encircling the LED chip; the inner wall is provided with a bottom edge connected with the surface of the lead frame, a top edge and a waist line between the bottom edge and the top edge; the encircled area of the bottom edge is smaller than that of the waist line, and the encircled area of waist line is smaller than that of the top edge; and the part of the inner wall between the waist line and the bottom edge is a curved surface. The area of the shell covering the surface of the lead frame is increased by using the curved surface to improve closeness, and the rays are reflected outwards by means of the curved surface to increase the light intensity; and the path of the reflected light is long, and the reflected light is fully acted with the fluorescent powder filled into the colloid of the shell, so the color coordinate distribution is more centralized.

Description

technical field [0001] The invention relates to an optoelectronic component, in particular to a light emitting diode packaging structure. Background technique [0002] see figure 1 , an existing light emitting diode package structure 1 includes a lead frame 11 , a housing 12 connected to the lead frame 11 , a light emitting diode chip 13 (LED Die) mounted in the housing 12 and located on the lead frame 11 , and a piece of colloid 14 accommodated in the housing 12 and covering the LED chip 13, the lead frame 11 includes a surface 111 for the LED chip 13 to be arranged on, and the housing 12 includes a sloped inner wall surface 121. The casing 12 in the aforementioned structure, because the area covering the surface 111 of the lead frame 11 is small, resulting in a short cross-sectional distance between the lead frame 11 and the casing 12 on one side of the joint surface 15, so the water vapor is easily passed through the external environment. The bonding surface 15 enters b...

AI Technical Summary

Problems solved by technology

[0002] refer to figure 1 , an existing light-emitting diode package structure 1 includes a lead frame 11, a housing 12 connected to the lead frame 11, a light-emitting diode chip 13 (LED Die) installed in the housing 12 and on the lead frame 11 , and a colloid 14 that is housed in the housing 12 and covers the LED chip 13, the lead frame 11 includes a surface 111 for the LED chip 13 to be placed on, and the housing 12 includes an inner wall surface that is inclined 121, the shell 12 in the aforementioned structure, because the area covering the surface 111 of the lead frame 11 is small, the cross-sectional distance of the joint surface 15 between the lead frame 11 and the shell 12 is relatively short, so water vapor easily passes through the external environment. The bonding surface 15 enters between the colloid 14 and the surface 111, thereby affecting the closeness between the colloid 14, the lead frame 11 and the housing 12, so how to provide a light-emitting diode packaging structure 1 that can improve the colloid 14 closeness , as the focus of the development of related industries

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