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Method for processing defensive move plate structure

A processing method and anti-slip technology, which is applied to metal processing equipment, manufacturing tools, milling machine equipment details, etc., can solve the problems of uneven structure of the anti-slip surface, easy deformation and misalignment of the anti-slip board, and achieve uniform structure , no misalignment, and the effect of meeting the requirements of surface roughness

Active Publication Date: 2012-12-19
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0007] The problem to be solved by the present invention is to provide a processing method for the anti-adhesion plate structure of vacuum sputtering, which solves the problems that the anti-adhesion plate is easily deformed in the process of processing, the uneven structure of the anti-adhesion surface is not neat, and is easy to be dislocated, and the surface finish is improved. Meet the size requirements of sputtering

Method used

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  • Method for processing defensive move plate structure
  • Method for processing defensive move plate structure
  • Method for processing defensive move plate structure

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Embodiment Construction

[0025] In the prior art, extrusion molding is used to process the uneven structure of the anti-adhesion surface of the anti-adhesion plate, and the processed anti-anchor plate has an incomplete structure and is easily deformed, and its size cannot meet the requirements of sputtering.

[0026] To this end, the embodiment of the present invention provides a processing method for the uneven structure of the anti-landing plate, including: providing the anti-landing plate blank; performing blanking operations on the anti-landing plate; rough milling the two surfaces of the anti-landing plate; The anti-ground surface of the landing plate; the uneven structure is formed on the anti-ground surface of the anti-landing plate, and the processing tool used is a ball end milling cutter. The diameter of the ball end milling cutter is 2 mm, and the processing parameters are set as the spindle speed of 3500-4500 n / min, the feed speed of 2200-2400 mm / min, and the cutting amount of 0.1-0.2 mm. ...

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Abstract

The invention relates to a method for processing a defensive move plate structure. The method comprises the following steps: providing a defensive move plate blank; blanking a defensive move plate; rough milling the two surfaces of the defensive move plate; carrying out fine milling on the defensive move surface of the defensive move plate; and processing the defensive move surface of the defensive move plate to form an uneven structure, wherein a ball head milling cutter is used as a processing tool. By using the processing method provided by the invention, the problems that the uneven structure of the defensive move surface of the defensive move plate is irregular and easy to deform are solved; and the obtained uneven structure of the defensive move surface of the defensive move plate is uniform, and has the advantages of high dimension accuracy and good surface finish quality.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to a processing method for a vacuum sputtering anti-impact plate structure. Background technique [0002] Vacuum sputtering, that is, vacuum sputtering coating, is that electrons collide with argon atoms during the process of accelerating to the substrate under the action of an electric field, ionize a large number of argon ions and electrons, and the electrons fly to the substrate. Under the action of the electric field, the argon ions accelerate the bombardment of the target, sputtering out a large number of target atoms, and the neutral target atoms (or molecules) are deposited on the substrate to form a film. [0003] However, during the above-mentioned vacuum sputtering process, a small amount of sputtered target atoms or large-sized particles will fly to the inner wall surface of the sputtering machine cavity, and finally deposit on the inner wall of the sputtering machine...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00B23C3/00B23C3/13
Inventor 姚力军潘杰王学泽范文新
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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