Electret microphone

An electret microphone and back electrode technology, applied in the field of microphones, can solve the problems of low surface flatness, low product qualification rate and high cost, and achieve the effects of simple production process adjustment, low material cost, and small number of

Active Publication Date: 2011-05-25
SHENZHEN HORN AUDIO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface flatness of round or square bead electret microphone products is not high, which is not conducive to large-scale SMT (Surface Mounted Technology, surface mount technology) production, and the cost of traditional square bead electret microphones High, the pass rate of products after SMT is low, and the performance is relatively poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 and figure 2 As shown, the electret microphone 100 of this embodiment includes a casing 110 and a diaphragm assembly 120 , an insulating gasket 130 and a back electrode assembly 140 sequentially arranged in the casing 110 . The housing 110 includes a square bottom plate 111 , a square circuit board 112 , and a square pillar-shaped support body 113 located between the bottom plate 111 and the circuit board 112 . The back electrode assembly 140 is electrically connected to the circuit board 112 .

[0025] The bottom plate 111 and the circuit board 112 are approximately the same in area and shape. The supporting body 113 defines an inner cavity (not shown in the figure) for accommodating the diaphragm assembly 120 , the insulating gasket 130 and the back electrode assembly 140 . Both ends of the support body 113 are closed by the bottom plate 111 and the circuit board 112 .

[0026] Preferably, the bottom plate 111 , the circuit board 112 and the supp...

Embodiment 2

[0039] Such as Figure 4 and Figure 5 As shown, the electret microphone 200 of this embodiment includes a casing 210 and a diaphragm assembly 220 , an insulating gasket 230 and a back electrode assembly 240 arranged in sequence in the casing 210 . The housing 210 includes a square bottom plate 211 , a square circuit board 212 , and a square pillar-shaped support body 213 located between the bottom plate 211 and the circuit board 212 . The back electrode assembly 240 is electrically connected to the circuit board 212 .

[0040]The bottom plate 211 and the circuit board 212 are approximately the same in area and shape. The supporting body 213 defines an inner chamber (not shown in the figure) for accommodating the diaphragm assembly 220 , the insulating gasket 230 and the back electrode assembly 240 . Both ends of the support body 213 are closed by the bottom plate 211 and the circuit board 212 . The dimensions of the bottom plate 211 , the circuit board 212 and the support...

Embodiment 3

[0046] Such as Figure 7 As shown, the electret microphone 300 of this embodiment includes a casing 310 and a diaphragm assembly 320 , an insulating gasket 330 and a back electrode assembly 340 arranged in sequence in the casing 310 . The housing 310 includes a square bottom plate 311 , a square circuit board 312 , and a square pillar-shaped support body 313 located between the bottom plate 311 and the circuit board 312 . The back electrode assembly 340 is electrically connected to the circuit board 312 .

[0047] The bottom plate 311 and the circuit board 312 are approximately the same in area and shape. The supporting body 313 is provided with an inner cavity (not shown in the figure) for accommodating the diaphragm assembly 320 , the insulating gasket 330 and the back electrode assembly 340 . Both ends of the support body 313 are closed by the bottom plate 311 and the circuit board 312 . The dimensions of the bottom plate 311 , the circuit board 312 and the support body ...

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PUM

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Abstract

The invention relates to an electret microphone. The electret microphone comprises a shell, a membrane component, an insulating gasket and a back electret component which are arranged in the shell in sequence, wherein the shell comprises a square bottom plate, a square circuit board and a square column-shaped support body arranged between the bottom plate and the circuit board; an inner cavity for accommodating the membrane component, the insulating gasket and the back electret component is arranged in the support body, and both ends of the support body are sealed by the bottom plate and the circuit board; and the back electret component is electrically connected with the circuit board. The top part of the electret microphone is directly sealed by the flat panel-type circuit board, and the smoothness of the top part of the electret microphone is much higher than that of shell edges curled by the traditional method, so that the SMT difficulty of the electret microphone is lowered, and the qualification rate of products is improved.

Description

【Technical field】 [0001] The invention relates to the field of microphones, in particular to an electret microphone. 【Background technique】 [0002] In the field of portable communication, most of the traditional electret microphones are designed with round bezel or square bezel. However, the surface flatness of round or square bead electret microphone products is not high, which is not conducive to large-scale SMT (Surface Mounted Technology, surface mount technology) production, and the cost of traditional square bead electret microphones High, the pass rate of products after SMT is low, and the performance is relatively poor. 【Content of invention】 [0003] Based on this, it is necessary to provide an electret microphone with high surface flatness. [0004] An electret microphone, comprising a casing and a diaphragm assembly, an insulating gasket and a back electrode assembly sequentially arranged in the casing, the casing includes a square bottom plate and a square c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/01
Inventor 欧阳小禾朱彪
Owner SHENZHEN HORN AUDIO
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