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Epoxy resin composition

A technology of epoxy resin and composition, which is applied in the direction of epoxy resin glue, physical instruments, adhesive types, etc., and can solve the problems of low sealing and/or bonding reliability, low chemical resistance, etc.

Inactive Publication Date: 2011-05-25
THREE BOND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] As mentioned above, the curable resin composition commonly used in the past has low chemical resistance to the lubricating oil of fluid bearing motors used in HDDs, etc., so there is a possibility that the cured product of the resin composition will deteriorate due to contact with the lubricating oil. , Disadvantages such as elution of components of the resin composition into lubricating oil, low reliability in sealing and / or bonding

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
  • Epoxy resin composition

Examples

Experimental program
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Effect test

Embodiment 1~14

[0040] The following components were prepared in order to prepare an epoxy resin composition.

[0041] (A) component: epoxy resin

[0042] ●Mixture of epoxy resin with bisphenol A skeleton and epoxy resin with bisphenol F skeleton (Epiclon EXA-835LV manufactured by Dainippon Ink Industry Co., Ltd.)

[0043] (B) Ingredient: rubber particles

[0044] Acrylic rubber particles (Zefiac F340 Zeon Kasei Co., Ltd.)

[0045] Butadiene rubber particles (Metablen E-901 manufactured by Mitsubishi Rayon Co., Ltd.)

[0046] ●Epoxy resin containing acrylic rubber particles (contains 20% by mass of rubber particles) (Acryset BPF-307 manufactured by Nippon Shokubai Co., Ltd.)

[0047] ●Epoxy resin containing butadiene rubber particles (contains 15% by mass of rubber particles) (Resibond RKB-1003 Resinous Chemicals Co., Ltd.)

[0048] (C) Component: Imidazole Derivatives

[0049] 1-Benzyl-2-methylimidazole (Curezol 1B2MZ manufactured by Shikoku Chemical Industry Co., Ltd.)

[0050] 2-Ethy...

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Abstract

Conventional curable resin compositions have low chemical resistance against lubricants for fluid bearing motors used in an HDD or the like, and thus suffer from problems such that cured products of the resin compositions are deteriorated due to contact with the lubricants or components of the resin compositions dissolve into the lubricants. Consequently, the conventional curable resin compositions are poorly reliable with respect to sealing performance and / or adhesion. The above-mentioned problems can be solved by using an epoxy resin composition composed of the following components (A)-(C). Component (A): an epoxy resin Component (B): rubber particles Component (C): an imidazole derivative.

Description

technical field [0001] The present invention relates to an epoxy resin composition used in sealing and / or bonding for preventing leakage of a lubricating fluid used in a fluid bearing type motor used in a hard disk drive or the like. Background technique [0002] In recent years, motors for hard disk drives (hereinafter referred to as HDDs) have required improvements in high speed and low noise (refer to Matsushita Technical Journal Vol. Feb. 2005). In order to satisfy these characteristics, fluid bearings are widely used. In this fluid bearing, a lubricating fluid is filled between a shaft (shaft) and a bearing (sleeve), and a pressure ( dynamic pressure) to support the load. In the case of this bearing, in order to generate dynamic pressure, the cross-sectional shape of the gap engraved with the bearing is generally called a herringbone groove such as a wedge shape or a stepped shape, and it is necessary to form a non-parallel shape. In a state where the shaft is stati...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J109/00C09J121/00C09J133/04C09K3/10C09K3/12F16C33/74
CPCC09K2200/0647C09K3/12F16C33/74F16C2370/12C08G59/4042C09K3/10C09J163/00C08L2666/08
Inventor 坂本宽树井上学
Owner THREE BOND CO LTD
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