Ear tag, main tag thereof and processing method of main tag
A processing method and main standard technology, applied in animal husbandry, etc., can solve problems such as difficulty in improving production efficiency, failure to bond firmly, poor structural consistency, etc., and achieve high production efficiency, easy promotion, and low production cost.
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specific Embodiment
[0039] A specific embodiment of the processing method of the main label of an ear tag of the present invention at least includes the following steps:
[0040] Step one, such as figure 2 As shown, a skeleton 10 of the main mark 1 is obtained. In this embodiment, the framework 10 is made of plastic material.
[0041] In this embodiment, the frame 10 has a T-shaped cross-section, a main neck 11 for detachable connection with an auxiliary ear tag (not shown in the figure), and an oblate chassis 12 . The main neck 11 and the chassis 12 can be integrally formed, or assembled together after being manufactured separately.
[0042] Further, coil slots 13 are formed on the side surfaces of the chassis 12 of the bobbin 10 . The coil slots 13 are preferably directly formed by a mold of the bobbin 10 . Of course, it can also be formed by post-processing the skeleton 10 .
[0043] Step two, such as image 3 , Figure 4 As shown, a coil 14 and a chip 15 are arranged on a skeleton 10 ...
Embodiment 2
[0048] see Figure 7 As shown, another embodiment of the processing method of the present invention, this embodiment is basically the same as the above-mentioned embodiment, the difference is that in step 2 of this embodiment, the coil 14 is wound separately first, and then the coil 14 is wound separately The coil 14 is arranged in the coil slot 13 of the end plane of the bobbin 10 .
[0049] Figure 8 The same dotted line shows the shape space defined by the mold of the main mark 1, and the shape space is an oblate disk ( Figure 8 shows its side shape), this shape space is the shape and position of the secondary injection molding part 16 of the main mark 1.
[0050] This embodiment can obtain the embodiment 1 Figure 6Shown are substantially the same main symbols and have substantially the same technical effect.
Embodiment 3
[0052] Another embodiment of the processing method of the present invention, this embodiment is basically the same as Embodiment 1, the difference is that in step 2 of this embodiment, the coil 14 and the chip 15 are electrically connected through bonding.
[0053] Specifically, the process of the bonding process is as follows: set welding time, pressure and other data according to the welding conditions; The power of the bonding machine rises; then the bonding machine applies pressure to the ordinary enameled wire through the welding head, so that the welding head and the ordinary enameled wire and copper sheet are in contact together; according to the set welding time, the power set by the bonding machine is maintained within a certain period of time , so that the ordinary enameled wire and the copper sheet are reliably welded together; according to the set down time, the power of the bonding machine is restored to the original state within a certain period of time, the press...
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