Method and device for treating waste liquid from circuit board preparation

A circuit board and waste liquid technology is applied in the field of treatment of waste liquid prepared by circuit boards, which can solve the problems of complex treatment process and high input cost, and achieve the effects of reducing waste treatment cost, simple process and removing chemical oxygen demand.

Inactive Publication Date: 2011-07-06
PEKING UNIV FOUNDER GRP CO LTD +1
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The inventor found that the treatment methods for the organic waste liquid and waste acid water produced in the circuit board preparation process provided by the prior art require separate treatment of these two waste liquids, and the treatment process is complicated and the input cost is too high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for treating waste liquid from circuit board preparation
  • Method and device for treating waste liquid from circuit board preparation
  • Method and device for treating waste liquid from circuit board preparation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0064] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0065] The embodiment of the present invention provides a method and device for treating waste liquid from circuit board preparation. The waste liquid discharged from the circuit board production line is directly used for the acidification of organic waste liquid without adding treatment chemicals, and the chemical oxygen demand of organic waste liquid is directly removed. And the purpose of reducing the consumption of a large amount of alkali in the waste acid...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The embodiment of the invention discloses a method and device for treating waste liquid from a circuit board preparation and relates to the field of circuit board preparation. In the invention, waste liquid from a circuit board production line is directly used for acidifying organic waste liquid without adding any processing chemicals so as to directly remove the chemical oxygen demand of the organic waste liquid and reduce a large amount of alkali consumed in a waste acidic water treatment process. The method for treating waste liquid from a circuit board preparation comprises: mixing organic waste from plate grinding pretreatment and / or plating pretreatment with waste acidic water from development and / or membrane stripping treatment for reaction to form a waste liquid product; and separating and removing the waste liquid product. The method and the device are used for treating waste liquid from the circuit board preparation.

Description

Technical field [0001] The invention relates to the field of circuit board preparation, and in particular to a method and device for treating waste liquid from circuit board preparation. Background technique [0002] In today's highly industrialized circuit board industry, quality and cost are the two key factors that restrict the market share of products. In particular, cost control has become the focus of attention of various manufacturers. It not only requires strict control by the manufacturing department , The production auxiliary department also needs to think of ways to reduce the processing cost of operation through management control and process improvement. [0003] In the circuit board preparation process, organic waste liquid will be generated during the development and stripping process. The organic waste liquid needs to be treated before discharge, such as figure 1 As shown, after the organic waste liquid is collected in the organic waste liquid collection tank, it is...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/04
Inventor 周波
Owner PEKING UNIV FOUNDER GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap