Highly dielectric material

A high-dielectric material and high-dielectric technology, applied in circuits, electrical components, insulators, etc., can solve problems such as limiting the application requirements of the electronics industry, reducing material stability and reliability, and increasing leakage current

Active Publication Date: 2011-07-06
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the increase of conductive powder will also increase the dielectric constant of the material system at the same time, resulting in an increase in leakage current, which will reduce the stability and reliability of the material, and limit its application requirements in the electronics industry...

Method used

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Examples

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Embodiment

[0028] The powder of embodiment 1-2

[0029] Put 10g of conductive carbon black (purchased from Degussa, particle size is about 30nm) into 100 ml (5wt%) of TALH aqueous solution, after stirring for 24 hours, filter and wash several times and dry, and then the surface contains conductive carbon black adsorbed by TALH The carbon black is calcined in an oven at 400°C for 2 hours at a high temperature. During the calcining process, the organic functional groups in the precursor TALH will be removed, and a discontinuous TiOx structure will be formed to modify the surface of the conductive carbon black, that is, the conductive-semiconductive composite powder of the present invention body. According to the identification of XRD and TEM, the discontinuous titanium oxide layer only modifies part of the carbon black surface but does not completely cover the carbon black.

[0030] The powder of embodiment 3-5

[0031] Put 10g of conductive carbon black (purchased from Degussa, particle...

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Abstract

The invention provides a highly dielectric material, comprising the following components in parts by weight: (a) 0.6-1 part of composite powder, (b) 58-79 parts of highly dielectric ceramic powder and (c) 20-41 parts of organic resin, wherein the composite powder is conductive-insulating composite powder, conductive-semiconductive composite powder or a combination of the conductive-insulating composite powder and the conductive-semiconductive composite powder. The dielectric constant of the highly dielectric material is greater than 100. At a proper operating voltage, the insulation resistance of the highly dielectric material is greater than 1 megohm, and the leakage current of the highly dielectric material is less than 50 milliampere. The highly dielectric material is quite suitable for being used as the dielectric material of an embedded type capacitive circuit board.

Description

technical field [0001] The invention relates to a composition of high dielectric materials, and in particular to conductive-insulating composite powder and / or conductive-semiconductive composite powder in the composition. Background technique [0002] In order to meet the high-functionality, high-speed and high-frequency requirements of electronic products, it is necessary to increase the active components and passive components on the electronic structure substrate. This results in increased board area and increased cost. In order to meet the requirements of lightness, thinness and compactness, the density of circuits and components will inevitably increase, resulting in increased electromagnetic interference and noise, and reduced reliability. In order to solve this problem, it is necessary to improve the integration of passive components, such as capacitors. In order to achieve the above goals, the polymer-ceramic composite material that has both the mechanical properti...

Claims

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Application Information

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IPC IPC(8): C04B26/02H01B3/00
Inventor 刘淑芬洪铭聪陈碧义
Owner IND TECH RES INST
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