Method of manufacturing printed wiring board with surface-mount component mounted thereon

A technology of surface mount components and printed wiring boards, which is applied in the manufacture of printed circuits, assembly of printed circuits with electrical components, printed circuits, etc., can solve the problems of no disclosure of methods to prevent Manhattan phenomenon backflow, and achieve the effect of preventing detachment

Active Publication Date: 2011-07-06
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this publication does not disclose a specific back

Method used

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  • Method of manufacturing printed wiring board with surface-mount component mounted thereon
  • Method of manufacturing printed wiring board with surface-mount component mounted thereon
  • Method of manufacturing printed wiring board with surface-mount component mounted thereon

Examples

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Example Embodiment

[0036] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the figure, the same or equivalent parts are marked with the same symbols, and their descriptions are not repeated.

[0037] (Overall structure of manufacturing equipment)

[0038] figure 1 It is a functional block diagram showing the overall configuration of a manufacturing apparatus for a printed wiring board mounted with a surface mount component according to a preferred embodiment of the present invention. Reference figure 1 , The manufacturing device 1 includes: a host 10, a solder printer 20, a solder inspection machine 30, surface mounters (chip mounters) 40A, 40B, and a soldering device 50. The manufacturing apparatus 1 is an apparatus that manufactures a printed wiring board mounted with a surface-mounted component by mounting the surface-mounted component on a printed wiring board.

[0039] The host computer 10 that controls each device connect...

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PUM

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Abstract

A method of manufacturing a printed wiring board (107) on which a surface-mount component (100) is mounted. The surface-mount component includes a plurality of electrodes (100a, 100b). The printed wiring board includes a plurality of lands (103, 103a, 103b). The lands are provided correspondingly to the electrodes. Each of the lands is soldered to the corresponding electrode. The manufacturing method includes a step of applying solder (104a, 104b) to the printed wiring board, a step of mounting the surface-mount component on the printed wiring board after the application of the solders, a step of detecting an inferior electrode such that the adhesion with the land by the surface tension of the molten solder is weaker than that between the other electrodes and the corresponding lands, and a step of shining a light beam so that the solder on the side for the detected inferior electrode can melt faster than the solder for the other superior electrodes. By the method, it is possible to prevent the inferior electrode from separating from the land.

Description

Technical field [0001] The present invention relates to a method of manufacturing a printed wiring board mounted with a surface-mounted component, and more specifically, to a method of manufacturing a printed wiring board by beam welding the surface-mounted component to a printed wiring board coated with solder. Background technique [0002] With the increase in performance of mobile phones, game consoles, music equipment, cameras, etc., ultra-high density of surface mount technology is required. More specifically, research has begun on the use of thin substrate mounting, flexible printed circuit board (FPC: Flexible Printed Circuits) mounting, 0402 (0.4mm×0.2mm) component mounting, and POP (Package On Package) mounting. [0003] Factors that affect quality in surface mounting include: (1) substrate and design, (2) metal mask, (3) solder solder printing, (4) solder paste (solder paste), (5) electronic components, (6) Quality of component installation, (7) Reflow, etc. [0004] In t...

Claims

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Application Information

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IPC IPC(8): H05K3/34B23K1/00B23K1/005B23K26/00B23K101/42
CPCH05K2203/163H05K3/3484H05K3/3442H05K1/0269H05K3/3494H05K2203/107H05K2201/10636B23K2201/40B23K1/0056B23K2101/40H05K3/3485Y02P70/50
Inventor 近藤裕藤田宏昭
Owner YAMAHA MOTOR CO LTD
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