Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method of manufacturing printed wiring board with surface-mount component mounted thereon

A technology of surface mount components and printed wiring boards, which is applied in the manufacture of printed circuits, assembly of printed circuits with electrical components, printed circuits, etc., can solve the problems of no disclosure of methods to prevent Manhattan phenomenon backflow, and achieve the effect of preventing detachment

Active Publication Date: 2011-07-06
YAMAHA MOTOR CO LTD
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this publication does not disclose a specific backflow method for preventing the Manhattan phenomenon at all.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of manufacturing printed wiring board with surface-mount component mounted thereon
  • Method of manufacturing printed wiring board with surface-mount component mounted thereon
  • Method of manufacturing printed wiring board with surface-mount component mounted thereon

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the figure, the same or equivalent parts are marked with the same symbols, and their descriptions are not repeated.

[0037] (Overall structure of manufacturing equipment)

[0038] figure 1 It is a functional block diagram showing the overall configuration of a manufacturing apparatus for a printed wiring board mounted with a surface mount component according to a preferred embodiment of the present invention. Reference figure 1 , The manufacturing device 1 includes: a host 10, a solder printer 20, a solder inspection machine 30, surface mounters (chip mounters) 40A, 40B, and a soldering device 50. The manufacturing apparatus 1 is an apparatus that manufactures a printed wiring board mounted with a surface-mounted component by mounting the surface-mounted component on a printed wiring board.

[0039] The host computer 10 that controls each device connect...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method of manufacturing a printed wiring board (107) on which a surface-mount component (100) is mounted. The surface-mount component includes a plurality of electrodes (100a, 100b). The printed wiring board includes a plurality of lands (103, 103a, 103b). The lands are provided correspondingly to the electrodes. Each of the lands is soldered to the corresponding electrode. The manufacturing method includes a step of applying solder (104a, 104b) to the printed wiring board, a step of mounting the surface-mount component on the printed wiring board after the application of the solders, a step of detecting an inferior electrode such that the adhesion with the land by the surface tension of the molten solder is weaker than that between the other electrodes and the corresponding lands, and a step of shining a light beam so that the solder on the side for the detected inferior electrode can melt faster than the solder for the other superior electrodes. By the method, it is possible to prevent the inferior electrode from separating from the land.

Description

Technical field [0001] The present invention relates to a method of manufacturing a printed wiring board mounted with a surface-mounted component, and more specifically, to a method of manufacturing a printed wiring board by beam welding the surface-mounted component to a printed wiring board coated with solder. Background technique [0002] With the increase in performance of mobile phones, game consoles, music equipment, cameras, etc., ultra-high density of surface mount technology is required. More specifically, research has begun on the use of thin substrate mounting, flexible printed circuit board (FPC: Flexible Printed Circuits) mounting, 0402 (0.4mm×0.2mm) component mounting, and POP (Package On Package) mounting. [0003] Factors that affect quality in surface mounting include: (1) substrate and design, (2) metal mask, (3) solder solder printing, (4) solder paste (solder paste), (5) electronic components, (6) Quality of component installation, (7) Reflow, etc. [0004] In t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/34B23K1/00B23K1/005B23K26/00B23K101/42
CPCH05K2203/163H05K3/3484H05K3/3442H05K1/0269H05K3/3494H05K2203/107H05K2201/10636B23K2201/40B23K1/0056B23K2101/40H05K3/3485Y02P70/50
Inventor 近藤裕藤田宏昭
Owner YAMAHA MOTOR CO LTD
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com