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TEC (Thermoelectric Cooling Module) refrigerating device and electrical device using same

A technology for refrigeration devices and electrical devices, which is applied to machines using electric/magnetic effects, refrigerators, and thermoelectric devices that only use Peltier or Seebeck effects, etc. problem, achieve the effect of increasing heat exchange rate and saving energy

Inactive Publication Date: 2012-12-12
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the large volume of refrigeration and air-conditioning does not conform to the current trend of equipment miniaturization; in addition, the refrigerant used in refrigeration and air-conditioning pollutes the environment greatly, which does not conform to the current concept of green environmental protection

Method used

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  • TEC (Thermoelectric Cooling Module) refrigerating device and electrical device using same
  • TEC (Thermoelectric Cooling Module) refrigerating device and electrical device using same

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0009] An embodiment of the present invention provides a thermoelectric refrigeration module (TEC) refrigeration device, and the TEC refrigeration device includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end opposite the cold end. The first heat exchange device is arranged at the cold end of the TEC module to exchange heat with the medium around the cold end of the TEC module. The second heat exchange device is arranged at the hot end of the TEC module, the second heat exchange device includes an evaporation end and a condensation end, and a cooling medium is arranged in the second heat exchange device, and the cooling medium is used for Heat exchange is performed by phase change at the evaporating end and the condensing end, and the evaporating end is adjacent to the hot end of the TEC module.

[0010] The TEC refrigeration device provided by the embodiment of the present invention adopts the ...

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PUM

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Abstract

A Thermoelectric Cooling (TEC) device is provided, which includes a TEC module, a first heat exchange device, and a second heat exchange device. The TEC module includes a cold end and a hot end corresponding to the cold end. The first heat exchange device is disposed at the cold end of the TEC module, and is configured to exchange heat with a medium surrounding the cold end of the TEC module. The second heat exchange device is disposed at the hot end of the TEC module; the second heat exchange device includes an evaporation end and a condensation end; a cooling medium is disposed in the second heat exchange device, and is configured to perform heat exchange at the evaporation end and the condensation end in a phase transition manner; and the evaporation end adjoins the hot end of the TEC module.

Description

technical field [0001] The invention relates to a refrigerating device, in particular to a TEC refrigerating device and an electrical device applied thereto. Background technique [0002] In the field of communication, electronic devices have higher requirements on the temperature of the working environment. Communication equipment generally dissipates heat during operation, and the dissipated heat gathers in the environment around the electronic equipment, resulting in an increase in the temperature of the working environment of the electronic equipment. When the temperature reaches a certain level, the electronic device will not work normally. In order to ensure the normal operation of the electronic device, it is often necessary to install a refrigeration air conditioner for the electronic device. However, the large volume of refrigeration and air conditioners does not conform to the current trend of equipment miniaturization; in addition, the refrigerant used in refriger...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02H05K7/20
CPCF25B2321/025F25B21/02H01L35/30H10N10/13
Inventor 方雯冯踏青
Owner HUAWEI TECH CO LTD