Double-purpose thin film equipment for sound transmission and extension and manufacturing method thereof

A thin-film, dual-purpose technology, applied in electret electrostatic transducers and other directions, can solve the problems of silicon microphones that need to be improved, bulky, and complicated structures of microphones and speakers.

Active Publication Date: 2011-08-03
SHENZHEN HORN AUDIO
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The structure of traditional microphones and loudspeakers is relatively complex, including multiple parts, and the volume is relatively large. The parts need to be precisely processed, and the process requirements are very strict.
However, the cost performance of the newly developed silicon microphone needs to be improved, and the packaging process and quality problems need to be improved urgently.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Double-purpose thin film equipment for sound transmission and extension and manufacturing method thereof
  • Double-purpose thin film equipment for sound transmission and extension and manufacturing method thereof
  • Double-purpose thin film equipment for sound transmission and extension and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Such as figure 1 and figure 2 As shown, the thin-film device 100 for sound transmission and loudspeaker in this embodiment includes: a piezoelectric electret thin film 110 and a circuit board assembly 120 .

[0030] The piezoelectric electret film 110 includes a porous polymer film 112 , electrodes 114 symmetrically arranged on both sides of the porous polymer film 112 , and film connection ends 116 electrically connected to the electrodes 114 .

[0031] The porous polymer film 112 of this embodiment is in the shape of a square with holes in a foam or honeycomb structure. Positive and negative charges are deposited on the upper and lower surfaces of the holes, respectively. In this embodiment, the pores of the porous polymer film 112 are disc-shaped or lens-shaped. The pores are closed longitudinally (thickness direction of the porous polymer film 112). The disc-shaped or lenticular holes are more easily compressed than the conventional circular or near-circular ho...

Embodiment 2

[0073] Such as image 3 , Figure 4 As shown, the thin-film device 200 for sound transmission and loudspeaker in this embodiment includes a piezoelectric electret thin film 210 and a circuit board assembly 220 . Different from Embodiment 1, the piezoelectric electret film 210 of this embodiment is provided with a plurality of electrodes 214 on the porous polymer film 212 to form an electrode array. Each pair of corresponding electrodes on both sides of the porous polymer film 212 constitutes a piezoelectric unit. Correspondingly, each piezoelectric unit is provided with a film connection end 216 .

[0074] The circuit board assembly 220 of this embodiment is fixed on the blank area of ​​the piezoelectric electret film 210, and is provided with a first connection end 222 electrically connected to the film connection end 216 and a second connection end for connecting to an external circuit. 224. The second connection end 224 is provided with a wired or wireless signal sendin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to double-purpose thin film equipment for sound transmission and extension, comprising a piezoelectric electret thin film and a circuit board assembly; the piezoelectric electret thin film includes a porous polymer thin film, electrodes symmetrically installed at the two sides of the porous polymer thin film, and a thin film connection end electrically connected with the electrodes; positive and negative charges are respectively deposited on the upper and lower surfaces of a hole on the porous polymer thin film; and a first connection end electrically connected with the thin film connection end and a second connection end connected with an external circuit are installed on the circuit board assembly. The positive and negative charges are deposited on the upper and lower surfaces of the hole on the porous polymer thin film so as to form an electric dipole; under the influence of the pressure of sound wave, the thickness of the hole on the piezoelectric film changes, such that the size of the electric dipole in the hole changes, and compensation charges in the electrodes also change; therefore, the voltage between the electrodes changes, namely acoustoelectric conversion is realized by using a piezoelectric effect; and vice versa, the thickness of the piezoelectric film vibrates according to a reciprocal piezoelectric effect, the sound wave is generated, and the electroacoustic conversion is realized.

Description

【Technical field】 [0001] The invention relates to the field of microphone loudspeakers, in particular to a dual-purpose thin-film device for sound transmission and loudspeaker and a manufacturing method thereof. 【Background technique】 [0002] The current microphones mainly include the traditional electret condenser microphone (ECM) and the silicon microphone (also known as microelectromechanical system (MEMS) microphone) developed in recent years. The electret condenser microphone is composed of a single-sided metal-plated electret film and a metal electrode (back pole) with several small holes. The electret face is opposite the back electrode with a tiny air gap in between, which forms a capacitor. Due to the polarized charge on the electret, there is a potential difference between the two poles of the capacitor. When the sound wave acts on the electret film, the vibration of the diaphragm produces displacement and changes the capacitance of the capacitor, so that the ou...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/01
Inventor 方鹏朱彪
Owner SHENZHEN HORN AUDIO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products