Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Method for manufacturing golf ball and golf ball manufactured by same

A golf ball and manufacturing method technology, applied in balls, solid core balls, sports accessories, etc., can solve the problems of heat damage to radio frequency electronic chips, low bonding strength, poor thermal insulation performance of hard shells, etc. Insulation effect, strong bond, enhanced shock resistance effect

Inactive Publication Date: 2011-08-17
田洪伟
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to provide a manufacturing method of a golf ball and the golf ball made therefrom, to solve the problem that the bonding strength between the hard casing of the radio frequency electronic chip and the golf ball body in the prior art is not high; and because The heat insulation performance of the hard shell is poor, resulting in the problem that the heat during injection molding may damage the radio frequency electronic chip

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing golf ball and golf ball manufactured by same
  • Method for manufacturing golf ball and golf ball manufactured by same
  • Method for manufacturing golf ball and golf ball manufactured by same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] see Figure 1 ~ Figure 3 , a method of manufacturing a golf ball, characterized in that it comprises the following steps in sequence:

[0021] (1) First potting: form a hard protective layer 4 on the outside of the RFID chip 5, and the RFID chip 5 includes an IC chip and an antenna solidified on the circuit board;

[0022] (2) Second potting: forming an adhesive layer 3 outside the protective layer 4;

[0023] (3) Sphere forming: casting and forming a rubber sphere 2 on the outside of the adhesive layer 3;

[0024] (4) Forming of the shell: the shell 1 is molded on the outside of the sphere 2 .

[0025] The operation process of the first potting (1) is as follows: a groove with a diameter of 16-18 mm and a depth of 5 mm is provided on the first mold; pour about 2 mm of temperature-resistant 160~ Put the epoxy resin encapsulant at 180°C into the RFID chip 5, and then cover the above-mentioned epoxy resin encapsulant with a temperature resistance of 160-180°C on the RF...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
thermal resistanceaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to a method for manufacturing a golf ball. The method is characterized by comprising the following steps: (1) primary encapsulating: forming a rigid protective layer outside an RFID (radio frequency identification device) chip; (2) the secondary encapsulating: forming a bonding layer outside the protective layer; (3) ball molding: casting and molding a rubber ball outside the bonding layer; (4) shell molding: casting and molding a shell outside the ball. The method has the advantages that because the melting point of the bonding layer outside the high-temperature resisting protective layer is basically identical to the temperature of the material of the rubber ball, when the rubber ball is casted and molded, an epoxy resin bonding agent of the bonding layer is melted, while the high-temperature resisting protective layer at the inner side is not melted and plays a role of heat insulation; the gap between the molded rubber ball and the encapsulated protective layer can be filled with the melted bonding layer, the rubber ball and the protective layer can be melted tougher tightly, the combination is firm, and shock-proof property is strengthened; additionally, by adding the binding layer, the insulation effect is strengthened and damage rate of the radio frequency electronic chip is reduced.

Description

technical field [0001] The invention relates to a manufacturing method of a golf ball and the golf ball made by the method, which is mainly used for producing golf balls for training and entertainment. Background technique [0002] The existing golf balls for training and entertainment mainly include encapsulating a radio frequency electronic chip (RFID) in an elastic sphere, and curing the radio frequency electronic chip in a protective hard shell (mainly composed of epoxy resin) protective layer); and then use the injection molding method to inject the rubber sphere material into the forming mold around the hard shell, and force cooling to form. Due to the high temperature of the molten sphere material (generally 130-150°C), in order not to affect the hard shell of the radio frequency electronic chip during injection molding, the temperature resistance of the hard shell needs to be higher than the temperature during injection molding, which is As a result, the hard shell ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): A63B45/00A63B37/00B29C39/02B29C45/00
Inventor 田洪伟
Owner 田洪伟
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products