Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber

Abstract

The invention relates to a method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber. The method comprises the following steps: 1) preparing an upper mold, a lower mold and a middle partition board, and installing the upper mold and the lower mold at a working region for later use; 2) placing a support in a charging box, and then placing the charging box at a feed inlet; 3) delivering the support to a positioning groove of the upper mold, then sleeving the middle partition plate for positioning, laying a thin film layer at the surface of the lower mold, and then injecting a glue into a glue storage groove; 4) combining the upper mold and the lower mold, and vacuumizing; 5) rising a piston at the bottom of the glue storage groove, pushing the glue into a glue inlet channel, and injecting the glue into a cavity which is formed by a stand-by support and the lower mold through the glue inlet channel, thus the injected glue is formed and solidified; and 6) separating the upper mold from the lower mold, pulling away the thin film, delivering the support to a machine discharge hole, and pushing the support out of a discharging box. The packaging method has the advantages of simple and reasonable working procedure and high production efficiency; automatic glue injection is adopted, the speed is rapid, the glue amount is consistent, and the package quality is good; and in addition, high temperature solidification is adopted, and the time is short.

Description

technical field [0001] The invention relates to a high-power LED packaging technology, in particular to a high-power LED liquid silica gel packaging method and a packaging mold thereof. Background technique [0002] The packaging of existing high-power LEDs usually adopts the following two methods: [0003] The first one is to manually cover the PC lens case in the LED bracket, then inject silica gel into the vent hole of the PC lens case, then place the bracket filled with silica gel in a cool place, and let it stand for a period of time until the silica gel is formed; [0004] The second is to buckle the bracket into the mold strip, then inject the glue into the mold strip, and then bake it into shape; [0005] Although the production process of the above two packaging methods is simple and does not require too much equipment investment, it is purely manual work and the production efficiency is low. Once the PC lens case or mold strip is not tightly combined with the brac...

AI Technical Summary

Problems solved by technology

[0005] Although the production process of the above two packaging methods is simple and does not require too much equipment investment, it is purely manual work and the production efficiency is low. Once the PC lens case or mold strip is not tightly combined with the bracket, air bubbles will be generated during glue filling, which will affect the quality of the product. There is no guarantee, so that the production cost cannot be effectively reduced, which affects product promotion

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