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Device including a textured substrate and method of fabricating a semiconductor device

A semiconductor and substrate technology, applied in the field of light-emitting devices, can solve the problems of increasing the cost and complexity of forming a package substrate and bonding processes

Active Publication Date: 2013-06-19
元芯光电股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this will increase the cost and complexity of forming the package substrate and bonding process

Method used

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  • Device including a textured substrate and method of fabricating a semiconductor device
  • Device including a textured substrate and method of fabricating a semiconductor device
  • Device including a textured substrate and method of fabricating a semiconductor device

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Embodiment Construction

[0027] The present invention provides a novel light emitting device (LED) and its manufacturing method. The invention also illustrates the intermediate stages of the manufacturing process. The changes and operations of the embodiment will be discussed below. In all the different drawings and embodiments, similar components will be represented by similar component symbols.

[0028] figure 1 The chip 100 is displayed, which may be a part of an uncut wafer containing multiple identical chips. Such as figure 1 The structure shown can also be a separate chip separate from the wafer. The chip 100 includes an LED 110 and is formed on the substrate 20. In one embodiment, the substrate 20 is made of sapphire (Al 2 O 3 ) Formed. In another embodiment, the substrate 20 is a silicon-containing substrate, such as a silicon carbide substrate, a silicon substrate, or a silicon germanium substrate. In another embodiment, the substrate 20 includes a compound semiconductor material containing...

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Abstract

A device includes a textured substrate, which further includes a plurality of trenches. Each of the plurality of trenches includes a first sidewall and a second sidewall opposite the first sidewall. A plurality of reflectors configured to reflect light is formed, with each of the plurality of reflectors being on one of the first sidewalls of the plurality of trenches. The second sidewalls of the plurality of trenches are substantially free from any reflector.

Description

Technical field [0001] The present invention relates to light-emitting devices (LEDs), and more particularly to a method of manufacturing LEDs on a textured substrate and the manufactured structure. Background technique [0002] Light emitting devices (LEDs), such as light emitting diodes or laser diodes, are widely used in a variety of applications. As known to those of ordinary skill in the art, LEDs may include semiconductor light-emitting elements having multiple semiconductor layers formed on a substrate. The substrate may be made of, for example, gallium arsenide, gallium phosphide, an alloy of the two, sapphire and / or silicon carbide. form. With continuous development, LEDs have become highly efficient and mechanically robust light sources, which can include visible light and spectrum other than visible light. This property and the potential long service life of solid-state devices enable LEDs to develop a variety of new display applications and can compete with incandes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/54H01L33/60H01L33/00
CPCH01L33/20H01L33/46H01L33/0093H01L33/0066H01L33/0075H01L33/22H01L2933/0025
Inventor 黄信杰
Owner 元芯光电股份有限公司