Element mounting device and element mounting method

Abstract

The invention provides an element mounting device and an element mounting method. The element mounting device comprises a head assembly and a control part. Elements are installed on a substrate by the head assembly. The motion of the head assembly is controlled by the control part. Meanwhile, the mounting position of elements is adjusted according to the printing offset of the solder with respect to the electrode. When the printing offset is within a correction permissible range, the elements are installed on the substrate with the offset position of the solder on the substrate as a reference. The correction permissible range is set according to the self-correction effect exhibited by the fused solder, so that the mounting position of the elements is corrected to be at the electrode side. When the printing offset exceeds the correction permissible range, the elements are installed with the specified position close to the electrode as a reference within the offset range of the solder on the substrate. Therefore, the mounting position of the elements is adjusted according to the offset, so that the bad welding is prevented and the elements are satisfactorily installed on the substrate.

Description

technical field [0001] The present invention relates to a component mounting device and a component mounting method for mounting components on a substrate on which solder is printed on electrodes. Background technique [0002] In order to manufacture a substrate on which electronic components are mounted (hereinafter referred to as "component mounting substrate"), the following steps are sequentially performed: Printing solder on electrodes formed on the substrate, so-called substrate electrodes (or pads), by a printing device A printing process; a mounting process of mounting components on a substrate printed with solder by a component mounting device; a reflow process of passing a substrate mounted with components through a reflow furnace. In the printing process among these steps, paste-like solder is printed on the surface of the substrate through the openings of the stencil while the stencil formed with the openings corresponding to the substrate electrode patterns is a...

AI Technical Summary

Problems solved by technology

Therefore, as will be described later, the solder protruding from the electrodes melts and adheres to the end faces of the electronic components due to the reflow process, and then largely infiltrates along the end faces, resulting in poor soldering.

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