Tin-zinc base composite soldering flux

A technology of composite welding and zinc solder, applied in welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of wettability and oxidation resistance not fundamentally solved, and the difficulty of popularization and application of solder, so as to achieve a combination of Tight, uniform particle distribution

Inactive Publication Date: 2011-08-31
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the wettability and oxidation resistance of Sn-Zn alloys have not been fundamentally resolved, in actual production it is often required to increase flux activity or atmosphere protection to help the solder achieve good wetting, so this solder is difficult to be used. Promote application

Method used

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  • Tin-zinc base composite soldering flux
  • Tin-zinc base composite soldering flux
  • Tin-zinc base composite soldering flux

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Example 1: In the tin-zinc based composite solder of the present invention, the weight percentages of the components are: 99% tin-zinc solder matrix, 1% Fe magnetic particles, and the average particle size of the Fe magnetic particles is 10 μm. The content of Zn in the tin-zinc solder base is 2% by weight of the tin-zinc base solder base, and the balance is Sn.

Embodiment 2

[0028] Example 2: In the tin-zinc based composite solder of the present invention, the percentage by weight of each component is: tin-zinc solder matrix 85%, Co magnetic particles 15%, and the average particle diameter of Co magnetic particles is 50 μm. The content of Zn in the tin-zinc solder base is 6% by weight of the tin-zinc base solder base, and the balance is Sn.

Embodiment 3

[0029] Example 3: In the tin-zinc based composite solder of the present invention, the weight percent of each component is: 98% of tin-zinc solder matrix, 2% of Ni magnetic particles, and the average particle size of Ni magnetic particles is 30 μm. The content of Zn in the tin-zinc solder base is 9% by weight of the tin-zinc base solder base, and the balance is Sn. figure 1 Its metallographic microstructure photo.

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Abstract

The provides tin-zinc base composite soldering flux which reduces the surface tension of the soldering flux and improves the wettability of the soldering flux. The tin-zinc base composite soldering flux is characterized in that the tin-zinc base composite soldering flux comprises a tin-zinc base soldering flux base body and magnetic particles with 1-15% of the weight percentage of the composite soldering flux, the tin-zinc base soldering flux base body comprises Sn and Zn, wherein the Zn is 2-10% of the weight percentage of the tin-zinc base soldering flux base body; and the magnetic particles are any one of or the combination of Fe, Co, Ni, Fe2O3 and Fe3O4. In the tin-zinc base composite soldering flux, the magnetic particles are evenly distributed in the soldering flux base body, and the solid-phase magnetic particles move to the surface of a soldering flux melting body to be enriched due to the function of magnetic force in an external magnetic field after melting in a heating way, so that the stress state on the surface of the soldering flux melting body is changed; and the tin-zinc base composite soldering flux has the effect of reducing the surface tension of the soldering flux when the direction of the external magnetic field force is inverse to the direction of the surface tension, therefore, the wettability of the soldering flux is improved.

Description

technical field [0001] The invention belongs to the field of electronic device welding and surface packaging materials, in particular to a composite lead-free alloy solder with a low melting point. Background technique [0002] Electronic products are packaged with a large amount of solder containing Pb, and Pb is a toxic substance, which poses a serious threat to human health. With the approval of the RoHS Directive (Restriction on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) and the WEEE Directive (Directive on Waste Electrical and Electronic Equipment) in the European Parliament, electronic products will be banned from containing Pb after July 1, 2006. Therefore, countries around the world are currently actively conducting research in the field of lead-free solder. [0003] The research on lead-free solder mainly focuses on alloy systems such as Sn-Ag, Sn-Zn and Sn-Cu. Among them, Sn-Zn solder is expected to become a new generation o...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40
Inventor 周健刘思栋姚瑶薛烽白晶
Owner SOUTHEAST UNIV
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